2121RGB lamp bead bracket and die bonding method

Abstract

The invention provides a 2121RGB lamp bead bracket and a die bonding method, belongs to the technical field of LED packaging, and aims to solve the problem of the inclined pull wire in secondary welding, improve the product performance, and satisfy the requirements of service life and stability of the lamp bead by providing the 2121RGB lamp bead bracket and the die bonding method. According to the adopted technical scheme, a bowl-shaped cup is arranged in the bracket; the bottom of the bowl-shaped cup is divided into multiple regions through isolation belts; a G- secondary welding point region and a B- secondary welding point region are arranged on one side of a chip fixing region in the bowl-shaped cup while an R- secondary welding point region is arranged on the other side of the chip fixing region; the isolation belts at the upper part of the R- secondary welding point region are bent upwards so as to enlarge the welding region; a G chip, an R chip and a B chip are linearly fixed in the chip fixing region at the bottom of the bowl-shaped cup in sequence; the G chip and the B chip are horizontally corresponding to the G- secondary-welding point region the B- secondary welding point region respectively, and are welded and conductive through gold threads; the G chip, the R chip and the B chip are all horizontally corresponding to the R- secondary welding point region, and are welded and conductive through gold threads; and all the secondary welding point regions are provided with packaging colloid.

Description

technical field [0001] The invention discloses a 2121RGB lamp bead bracket and a crystal bonding method, belonging to the technical field of LED packaging. Background technique [0002] SMD 2121RGB lamp bead welding process is currently based on the shape of the bracket and the position of the solid crystal to determine the welding wire position of the positive and negative electrodes of the chip. Since the 2121RGB lamp bead is a common anode of the four-corner bracket, and the fixed position of the chip is generally red and green. , blue, so the 3 chips need to pull the gold wire obliquely during the second welding. When the wire bonding machine moves on the X and Y axes at the same time, the fishtail of the second solder joint will be deformed, reducing the firmness of the solder joint. With the advancement of LED chip technology, the brightness of the chip is improved, the size of the chip is reduced, the electrode of the chip is reduced, and the distance between the posi...

AI Technical Summary

Problems solved by technology

The reduction of the diameter of the gold wire and the reduction of the caliber of the chopper will reduce the contact surface of the solder joint and the tension of the gold wire of the welding wire, so that there is a risk of the solder joint detaching at the fishtail of the second welding oblique welding, which will affect the LED lamp bead The reliability of the ceramic nozzle will also have a certain impact on the life of the porcelain nozzle, which will increase the production cost

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