Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Inspection system, inspection method, and readable recording medium

An inspection system and sampling inspection technology, applied in the direction of optical testing flaws/defects, instruments, measuring devices, etc., can solve the problems of discrete differences in the characteristic values ​​of inspection blocks, and achieve the effect of stable grade division and good production quality.

Inactive Publication Date: 2016-06-29
SHARP KK
View PDF12 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] When the inspection block dividing unit 107 divides the inspection target region so that the number of components included in the inspection blocks is approximately the same, there is a possibility that the dispersion of the characteristic values ​​in each inspection block may be greatly different.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Inspection system, inspection method, and readable recording medium
  • Inspection system, inspection method, and readable recording medium
  • Inspection system, inspection method, and readable recording medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0086] figure 1 It is a block diagram showing an example of the main part hardware configuration of the inspection system according to Embodiment 1 of the present invention.

[0087] exist figure 1 Among them, the inspection system 1 of the first embodiment is composed of a computer system, including: a CPU2 (central processing unit) as a control unit for overall control; an initial screen, a selected scene, and a control result screen of the CPU2 are displayed on the display screen. and the display unit 3 of the operation input screen, etc.; the keyboard, mouse, and touch panel for inputting instructions to the CPU 2, and the operation unit 4 of an input device such as receiving an input via a communication network (such as the Internet, an intranet); ROM5 of a computer-readable recording medium for programs and its data, etc.; reads the control program and its data, etc. at startup, reads and stores data in each control performed by the CPU2, and operates as a work memory...

Embodiment approach 2

[0180] For the above Embodiment 1 Figure 5 (b) and Figure 5 The flow example in (c) described the case where the sampling inspection of optical characteristics and the entire inspection of DC characteristics are performed using different flows. However, in the second embodiment, as Figure 5 (d) and Figure 5 As in the flow example of (e), a case will be described in which inspection (OPT+DC) is performed by integrating the single-unit measurement of optical characteristics and multiple simultaneous measurement functions of DC characteristics in one device. In addition, in this Embodiment 2, except Figure 5 (d) and Figure 5 Other than the flow example of (e), other content such as (number of interpolation data; number of sampling chips), (example of pre-evaluation of the introduction of the number of sampling chips), (judgment criteria for pre-evaluation of the introduction of the number of sampling chips; interpolation inspection evaluation Judgment criteria), (interp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention inspects all DC characteristics, inspects the optical characteristics of a sample, is capable of more stable grading, and enhances delivery quality. A CPU (2) is provided as a control unit for controlling the creation of information that has been ranked and divided by a grading unit (24) into information about each grade of light emitting element group on the basis of map information synthesized from: optical element optical characteristic values collected by a sampling inspection unit (21) from sampling inspection carried out by an optical characteristic inspection unit (7) for each of a prescribed number of optical elements, optical characteristic values for uninspected light emitting elements determined through interpolation by an inspection interpolation unit (23) on the basis of the plurality of optical characteristic values from the sampling inspection by the optical characteristic inspection unit (7), and quality information (nondefective product / defective product information) determined by a pass / fail determination unit (22) from the inspection of the electrical characteristics (DC characteristics) of all the plurality of optical elements on the entire surface of a wafer by a DC inspection unit (8).

Description

technical field [0001] The present invention relates to an inspection system for performing various inspections on a plurality of semiconductor chips on a semiconductor wafer, an inspection method using the inspection system, and a control program storing a processing flow for causing a computer to execute each step of the inspection method computer-readable storage medium. Background technique [0002] In a manufacturing process using a semiconductor process, semiconductor chips are formed in a matrix on a wafer. The formed semiconductor chips are inspected for good and bad at the stage of commercialization. For example, there are cases where inspection is performed in the state of a wafer, cases where inspection is performed in a state where individual chips are separated from the wafer, and cases where final inspection is performed after mounting in a package, and the like. In the inspection of this semiconductor chip, even in light-emitting components represented by LE...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/95
CPCG01N21/9501
Inventor 内田练石川真治斋藤仁尾上毅案野宏隆佐藤刚
Owner SHARP KK
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com