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Spray Plating Unit for Terminal Electrodes

An electroplating device and a spray-type technology, applied in the electrolysis process, electrolysis components, cells, etc., can solve the problems of large footprint, waste of water and electricity, and restrictions on the automation upgrade process of electronic component manufacturers, and achieve modularization acceleration and occupation small area effect

Active Publication Date: 2018-04-10
SHENZHEN ZHENHUA FU ELECTRONICS +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the manufacturing industry is developing towards automation and modularization. In the electronic component industry chain, the terminal electrode treatment of electronic components is mainly processed by electroplating. The traditional electroplating method occupies a large area and wastes energy such as water and electricity. , which limits the automation upgrade process of electronic component manufacturers

Method used

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  • Spray Plating Unit for Terminal Electrodes
  • Spray Plating Unit for Terminal Electrodes

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Embodiment Construction

[0017] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0018] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes ...

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Abstract

The invention discloses a jet electroplating device applicable to a terminal electrode. The jet electroplating device comprises a plating solution storage box used for storing a plating solution, a jet assembly, an electroplating power source and a controller, wherein the jet assembly is connected with the plating solution storage box and is opposite to a plating piece; the jet assembly, the plating piece and the electroplating power source are connected to form a closed electroplating loop; and the controller is connected with the electroplating power source and the jet assembly, and is used for controlling currents and / or voltage externally added on the closed electroplating loop. According to the jet electroplating device, the automation is achieved under the control of the controller; and besides, the device is water-saving and electricity-saving, and is small is floor space, so that the modularization of the electroplating procedure is achieved, and the automation upgrading of the production line is accelerated.

Description

technical field [0001] The invention relates to a spray electroplating device suitable for terminal electrodes. Background technique [0002] With the continuous advancement of science and technology and the rapid development of the information industry, large-scale and ultra-large-scale integrated circuits have become the mainstream and trend of development. At present, the manufacturing industry is developing towards automation and modularization. In the electronic component industry chain, the terminal electrode treatment of electronic components is mainly processed by electroplating. The traditional electroplating method occupies a large area and wastes energy such as water and electricity. , Limiting the automation upgrade process of electronic component manufacturers. Contents of the invention [0003] Based on this, it is necessary to provide a spray electroplating device suitable for terminal electrodes that can effectively save energy, occupy an area, and facilit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/08C25D17/00C25D21/12
CPCC25D5/08C25D17/00C25D21/12
Inventor 钟景高王上衡朱建华黄寒寒施威王智会石菊幸
Owner SHENZHEN ZHENHUA FU ELECTRONICS
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