Electrotinning additive and preparation method and use method thereof

An additive and electroplating tin technology, applied in the field of electroplating tin additive and its preparation, can solve the problem of high temperature and achieve the effect of reducing energy consumption

Active Publication Date: 2016-06-22
JIANGSU AISEN SEMICON MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, all high-speed pure tin electroplating additives on the market are used for electroplating at a temperature of 40-50°C, and the temperature is relatively high.

Method used

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  • Electrotinning additive and preparation method and use method thereof
  • Electrotinning additive and preparation method and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Carry out the proportioning and weight percentage of each component according to the following ratio: TritonCF-10 type nonionic surfactant 5%, LugalvanBNO12 type β-naphthol polyoxyethylene ether 10%, APG type alkyl glucoside 3%, LugalvanHS1000 type Thiodiglycol ethylate 3%, catechol 2%, and the rest is deionized water.

[0025] Among them, TritonCF-10 type nonionic surfactant is provided by Dow Chemical Company, LugalvanBNO12 type β-naphthol polyoxyethylene ether and LugalvanHS1000 type thiodiglycol ethyl compound are provided by BASF, and APG type alkyl glycoside is provided by Shanghai Provided by Fakai Chemical Co., Ltd.

[0026] The preparation process of this embodiment electroplating tin additive is:

[0027] ① Add 30% deionized water to the container;

[0028] ② When stirring, add non-ionic surfactant according to the ratio and stir evenly;

[0029] ③ While stirring, add β-naphthol polyoxyethylene ether at a constant speed according to the proportion, and cont...

Embodiment 2-5

[0036] The method of Experimental Example 1 was repeated according to the content of each component specified in Table 1 below, to obtain electroplating tin additives with different formulations.

[0037] Table 1:

[0038]

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PUM

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Abstract

The invention belongs to the technical field of electroplating and relates to an electrotinning additive and a preparation method and a use method thereof. The electrotinning additive is composed of 3-5% of non-ionic surface active agents, 5-10% of beta-naphthol polyoxyethylene ether, 1-3% of alkyl glycoside, 1-3% of thiodiglycol ethide, 1-2% of catechol and the balance deionized water. According to the electrotinning additive and the preparation method and the use method thereof, the electroplating effect of tin electroplating liquid at 20-25 DEG C can be the same as the electroplating effect without the additive at 40-50 DEC C, and therefore the energy consumption of electroplating can be lowered, and the environmental friendliness is higher.

Description

technical field [0001] The invention relates to the technical field of chemical purification, in particular to an electroplating tin additive capable of achieving a similar electroplating effect at a lower temperature, a preparation method and a use method thereof. Background technique [0002] At present, the output value of the global PCB industry reaches 45 billion US dollars per year, second only to the semiconductor industry in the electronics industry, and China's growth rate has cost and market advantages. Due to the impact of cost and downstream industry transfer, the PCB industry is gradually transferring to China. China is the most growing PCB market in the world. At the same time, due to the unique position of PCB in the electronic basic industry, it has become the most active industry in the contemporary electronic component industry. [0003] With the continuous development of CPU and other ultra-large integrated circuits, the packaging form of integrated circu...

Claims

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Application Information

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IPC IPC(8): C25D3/32
CPCC25D3/32
Inventor 陈春张兵赵建龙
Owner JIANGSU AISEN SEMICON MATERIAL CO LTD
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