Ultrasonic field auxiliary vacuum diffusion connecting device and method

Abstract

The invention relates to an ultrasonic field auxiliary vacuum diffusion connecting device and method, aims at solving the problems that according to an existing vacuum diffusion connecting method, the requirement for a joint surface is strict, a surface oxidization film is hard to remove, the connecting time is long, and connecting temperature reduction and deformation resistance reduction cannot be combined, and belongs to the technical field of diffusion connection. The device comprises an upper pressing head, an upper pressing plate, an upper sample, a lower sample, a lower pressing plate, supporting devices, an ultrasonic tool head, a vacuum chamber and a heating body. The method comprises the steps that to-be-welded base metal is cleaned; the to-be-welded base metal is assembled and placed in the vacuum chamber, the pressure is exerted, and the temperature is increased to the connecting temperature; ultrasonic vibration is exerted; and the pressure is increased, and insulating is completed. The deformation resistance of the base metal is reduced, breaking of a surface oxidization film of the base metal is accelerated, the diffusion behavior is accelerated, the connecting temperature and the connecting pressure are reduced, the connecting time is shortened, and the requirement for the surface state of the to-be-welded base metal is lowered.

Description

technical field [0001] The invention relates to an ultrasonic field assisted vacuum diffusion connection device and method. Background technique [0002] Diffusion bonding (also known as diffusion welding) refers to the surfaces of materials that are in contact with each other. Under the action of high temperature and pressure, the connected surfaces are close to each other, plastic deformation occurs locally, mutual diffusion occurs between atoms, and a new diffusion layer is formed at the interface. Thus forming a reliably connected joint. [0003] The diffusion bonding process can be roughly divided into three processes (also known as three stages) of physical contact, activation of the contact surface, diffusion and joint formation. The first stage is the physical contact stage. Under the action of external pressure on the microscopically uneven surface at high temperature, the local contact point first achieves plastic deformation. Under the action of continuous pressu...

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Problems solved by technology

[0005] The purpose of the present invention is to solve the problems that the existing vacuum diffusion connection method has strict requirements on the joint surface, difficult to remove the surface oxide film, long connection time and inability to reduce the connection temperature and deformation resistance, and provide an ultrasonic field assisted vacuum diffusion method. Connection device and method

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