cooling equipment

Abstract

Disclosed is a heat-dissipation apparatus, of which the weight is lowered and the heat-dissipation efficiency is improved. The heat-dissipation apparatus comprises an evaporator (110), a first-stage pressure balancer (120), a manifold (130), a condenser (140), and a second-stage pressure balancer (150), wherein multiple steam pipelines (111) are provided in the evaporator (110); a working medium is separately added in the multiple steam pipelines (111); the upper side of the evaporator (110) is communicated with the lower side of the first-stage pressure balancer (120) by means of the multiple steam pipelines (111); the upper side of the first-stage pressure balancer (120) is communicated with the lower side of the manifold (130); the upper side of the manifold (130) is communicated with the lower side of the condenser (140); the upper side of the condenser (140) is communicated with the lower side of the second-stage pressure balancer (150).

Description

technical field [0001] Embodiments of the present invention relate to the field of heat dissipation, and more specifically, to a heat dissipation device. Background technique [0002] In the future 5G technology, hardware devices will be highly integrated, coupled with many requirements such as product miniaturization, high heat flux density and uniform temperature of devices, the existing heat dissipation equipment will not be able to meet the heat dissipation needs of future products. For example, the existing straight-tooth radiators or die-cast straight-tooth radiators are bulky, heavy, difficult to disassemble, and have the disadvantages of uneven heat dissipation and low heat dissipation efficiency. The loop gravity heat pipe (Loop Thermosiphon, LTS) radiator adopts phase change heat dissipation technology, and the heat dissipation performance of the LTS radiator is improved compared with the die-cast radiator, but the volume and weight are still large, and it cannot b...

AI Technical Summary

Problems solved by technology

[0002] In the future 5G technology, hardware equipment will be highly integrated, coupled with many requirements such as product miniaturization, high heat flux density and uniform temperature of devices, the existing heat dissipation equipment will not be able to meet the heat dissipation needs of future products

For example, the existing straight-tooth radiators or die-cast straight-tooth radiators are bulky, heavy, difficult to disassemble, and have the disadvantages of uneven heat dissipation and low heat dissipation efficiency

The loop gravity heat pipe (Loop Thermosiphon, LTS) radiator adopts phase change heat dissipation technology, and the heat dissipation performance of the LTS radiator is improved compared with the die-cast radiator, but the volume and weight are still large, and it cannot be miniaturized and lightweight

Moreover, due to the external piping of the LTS radiator, the heat dissipation efficiency of the heat dissipation substrate is limited

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