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A method for improving the hot-damp resistance of CEM-1 copper-clad laminates

A technology of copper clad laminate and CEM-1, applied in the field of copper clad laminate, can solve the problem that copper clad laminate cannot be guaranteed the heat resistance of copper clad laminate, so as to reduce the risk of foaming and delamination and enhance chemical effect strength, and the effect of enhancing other properties

Active Publication Date: 2018-12-21
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this invention is to provide a method for improving the hot flash resistance of CEM-1 copper-clad laminates, which solves the problem that the traditional two-time dipping process cannot ensure the cladding while improving the flame retardancy of CEM-1 copper-clad laminates. Problems of heat resistance of copper foil laminates

Method used

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  • A method for improving the hot-damp resistance of CEM-1 copper-clad laminates
  • A method for improving the hot-damp resistance of CEM-1 copper-clad laminates

Examples

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preparation example Construction

[0052] The preparation method of embodiment copper-clad laminate:

[0053] 1) Preparation of water-soluble small molecule resin composition

[0054] Put the water-soluble phenolic resin, water-soluble cyclotriphosphazene flame retardant, water-soluble nitrogen-containing flame retardant, and additives into the container, stir to make them evenly mixed, and adjust the solid content of the solution to 15% to 30% with a solvent. Make glue solution, promptly obtain water-soluble small molecule resin composition.

[0055] 2) Preparation of oil-soluble small molecule resin composition

[0056] The phosphorus-containing epoxy resin and the phosphazene resin are put into a container, stirred to make them evenly mixed, and the solid content of the solution is adjusted to 15% with a solvent to make a glue solution, and the oil-soluble small molecule resin composition is obtained.

[0057] 3) Preparation of oil-soluble macromolecular resin composition

[0058] Put phosphorus-containin...

Embodiment 1

[0095] Comparing Example 1 with Comparative Example 1, Comparative Example 2, and Comparative Example 3, it can be seen that Comparative Example 1 is superior to Example 1 in terms of dipping solderability, 240°C baking plate, and T260, but its moisture resistance is not as good as that of Example 1, and there is no Flame retardancy, indicating that simply using water-soluble phenolic resin can greatly improve the heat resistance of copper clad laminates, but copper clad laminates are not flame retardant. Although the flame retardancy of Comparative Example 2 is improved compared with Comparative Example 1, it still does not reach the V-0 level, and the heat resistance also reduces to some extent simultaneously, and its comprehensive performance is not as good as that of Example 1, indicating that the introduction of cyclotriphosphazene Flame retardants can improve the flame retardancy of copper clad laminates, and have no major impact on heat resistance. Compared with Example...

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Abstract

The invention discloses a method for improving moisture-resistant and heat-resistant performance of a CEM-1 copper foil-clad laminate. A base body material is subjected to three times of gum dipping; during the first time of gum dipping, water-soluble micromolecular resin compositions are used; during the second time of gum dipping, oil-soluble micromolecular resin compositions are used; during the third time of gum dipping, oil-soluble macromolecular resin compositions are used, wherein the water-soluble micromolecular resin compositions is prepared from the following ingredients in parts by solid weight: 3 to 12 parts of water-soluble phenol-formaldehyde resin, 2 to 15 parts of water-soluble cyclotriphosphazene flame retardants, 3 to 13 parts of water-soluble nitrogenous flame retardants and 0.1 to 1.0 part of accessory ingredients. The method has the advantages that on the precise of ensuring the V-0 stage flame-retardant performance of the CEM-1 copper foil-clad laminate, the heat-resistant performance of the copper foil-clad laminate is improved; the water absorption rate of the copper foil-clad laminate is reduced; the consumption of the flame-retardant filling in the oil-soluble macromolecular resin compositions is reduced.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a method for improving the hot tide resistance of a CEM-1 copper-clad laminate. The invention also relates to a prepreg and a copper-clad laminate produced by the method. Background technique [0002] CEM-1 Copper Clad Laminate is hot-pressed with wood pulp paper prepreg as the core material and glass fiber cloth prepreg as the fabric. Due to the small pores of wood pulp paper fibers, the core material of CEM-1 is mainly impregnated twice, the first time using water-soluble small molecule resin, and the second time using oil-soluble macromolecular resin. Although this kind of dipping process can improve the wettability of resin on wood pulp paper, due to the uneven distribution of pore sizes in wood pulp paper, the pores of wood pulp paper are not filled sufficiently by two dipping processes, resulting in CEM-1 coating. Copper foil laminates have high w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/06C08L61/32C08K5/5399C08K5/29C08K5/5425C08K5/544B32B15/12B32B15/20B32B29/06B32B27/04
CPCB32B15/12B32B15/20B32B2250/40B32B2260/028B32B2260/046B32B2307/306B32B2307/3065B32B2307/726C08K5/29C08K5/5399C08K5/5425C08L61/06C08L61/32C08L2201/02C08L2201/08C08L2201/22C08L2203/20C08L2205/02C08K5/544
Inventor 霍国洋马抗武
Owner SHAANXI SHENGYI TECH
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