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Electronic component mounting device

A technology for electronic component installation and electronic components, applied in the direction of electrical components, electrical components, etc., can solve problems such as difficulty in holding

Active Publication Date: 2019-12-31
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These above-mentioned connector-type electronic parts having an insertion part are formed with an insertion part for inserting various parts, and since it is a structure in which a member of a plate-shaped part is inserted, it is a shape extending in one direction, so there is a possibility of Electronic components that maintain difficult shapes

Method used

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  • Electronic component mounting device
  • Electronic component mounting device
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Examples

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Embodiment Construction

[0049] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the invention mentioned below. In addition, the constituent elements in the following embodiments include elements within a so-called equivalent range, such as elements that can be easily conceived by those skilled in the art, substantially the same elements, and the like. In addition, components disclosed in the following embodiments may be appropriately combined.

[0050] Hereinafter, embodiments of the electronic component mounting apparatus according to the present invention will be described in detail based on the drawings. In addition, this invention is not limited by this embodiment. The electronic component mounting device of the present invention is an electronic component mounting device for mounting a so-called plug-in type electronic component and a mount-...

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PUM

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Abstract

The invention provides an electronic component mounting device which can keep and convey an electronic component with the shape that is relatively difficult to keep through absorption or clamping. The electronic component mounting device is provided with a substrate conveying part; an electronic component supplying device which supplies connector type electronic components; a carrying head which is provided with an electronic component conveying suction nozzle for keeping the connector type electronic components and a suction nozzle driving part that drives the electronic component conveying suction nozzle, wherein the electronic component conveying suction nozzle is used for keeping the connector type electronic component and conveying from the electronic component supplying device to the substrate and mounting the connector type electronic component on a substrate; a carrying head moving mechanism which moves the carrying head; and a control device which is provided with a carrying head control part for controlling motion of the carrying head. The control device prevents motion of the electronic component conveying suction nozzle on condition that the electronic component conveying suction nozzle is mounted and the electronic component conveying suction nozzle exceeds threshold of a movable position at the upper side of the vertical direction in the vertical direction.

Description

technical field [0001] The present invention relates to an electronic component mounting device for mounting electronic components on a substrate. Background technique [0002] The electronic component mounting apparatus mounts the electronic component on the substrate by repeating the operation of holding the electronic component by the suction nozzle provided on the mounting head and mounting it on the mounting point of the substrate. In recent years, there have been proposed electronic component mounting apparatuses capable of mounting, in addition to mounted electronic components mounted on a substrate, plug-in electronic components having leads that are inserted into holes in the substrate. inserted and mounted on a substrate (refer to Patent Document 1). [0003] In addition, Patent Document 1 describes a suction nozzle of such a mechanism that sucks and holds an electronic component, and a grip type nozzle of such a mechanism that grips and holds an electronic compon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
Inventor 儿玉裕介
Owner JUKI CORP
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