Lamination process of circuit board and ferrite

A circuit board and ferrite technology, applied in circuit devices, printed circuit components, etc., can solve the problems of low production efficiency, increased labor and material costs, etc., to improve quality, reduce labor and material costs, and facilitate lamination. Effect

Active Publication Date: 2016-05-11
惠州市科迪诺电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Attaching ferrite on the circuit board is to prevent the signal receiver of the mobile phone from being interfered by the circuit board in the power-on state, causing the signal received by the signal receiver to be unstable. However, during the bonding process of the circuit board and the ferrite, All of them bond a piece of circuit board and a piece of ferrite, which increases the cost of manpower and material resources, and the production efficiency is low

Method used

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Embodiment Construction

[0012] A bonding process between a circuit board and a ferrite provided in an embodiment of the present invention is characterized in that it includes the following steps:

[0013] (1) Prepare a large magnetic sheet, and use a laser cutting machine to cut out multiple small magnetic sheets with the same shape as the small circuit board on the large magnetic sheet;

[0014] (2) Prepare a large piece of ferrite with the same shape as the large magnetic piece, and coat a layer of glue on one side of the large piece of ferrite;

[0015] (3) Prepare a large piece of circuit board, and lay out multiple small circuit boards with the same shape as the small magnetic piece on the large piece of circuit board;

[0016] (4) Lay one side of the large piece of ferrite without adhesive layer to the large piece of magnetic sheet, and one side of the large piece of ferrite with adhesive layer to the large piece of circuit board. Among them, each small piece of magnetic piece is set correspond...

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PUM

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Abstract

The invention provides a lamination process of a circuit board and a ferrite. The lamination process comprises the following steps of sequentially laminating a large magnet sheet, a large ferrite and a large circuit board, wherein the large magnet sheet, the large ferrite and the large circuit board can be laminated together after rolling by a rolling machine; and sequentially punching a small magnet sheet, a small ferrite and a small circuit board by a punching machine to obtain a required product. Compared with the prior art, the lamination process has the advantages that the lamination frequency is reduced, the lamination efficiency is improved, and labor and material cost is reduced; meanwhile, dust falling into a product during the lamination process of the product is also reduced, and the product quality is improved; and moreover, the large ferrite and the large magnet sheet are magnetically absorbed, convenient lamination is achieved, the lamination efficiency is further enhanced, and the shielding effect is high when the ferrites and the magnet sheets are combined.

Description

technical field [0001] The invention relates to a bonding process of a circuit board and ferrite. Background technique [0002] Attaching ferrite on the circuit board is to prevent the signal receiver of the mobile phone from being interfered by the circuit board in the power-on state, causing the signal received by the signal receiver to be unstable. However, during the bonding process of the circuit board and the ferrite, All of them bond a piece of circuit board with a piece of ferrite, which increases the cost of manpower and material resources, and the production efficiency is low. Contents of the invention [0003] The object of the present invention is to overcome the shortcomings of the above-mentioned prior art, and provide a bonding process of circuit board and ferrite with high bonding efficiency. [0004] The present invention is achieved in this way, a bonding process of circuit board and ferrite, comprising the following steps: [0005] (1) Prepare a large ...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0213
Inventor 江新
Owner 惠州市科迪诺电子科技有限公司
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