Magnetron sputtering device and magnetron sputtering method

Abstract

The invention discloses a magnetron sputtering device and a magnetron sputtering method. The magnetron sputtering device comprises a substrate table for placing a substrate, a target opposite to the substrate table and used for sputtering the substrate, and a reaction cavity for accommodating the substrate table and the target. The magnetron sputtering device further comprises an angle adjusting device corresponding to the target and used for adjusting an angle of the corresponding target to the substrate table. The magnetron sputtering method comprises the following steps: (1) the reaction cavity and the substrate are cleaned; and the target is mounted; (2) the angle of the target corresponding to the substrate and the distance between the target and the substrate are adjusted; (3) the reaction cavity is vacuumized; (4) the presputtering is performed; and meanwhile, the rotating and swinging functions of the substrate table are started; and (5) the magnetron sputtering is performed. The device can be applied to deposition of large-area films with high uniformity and excellent repeatability, and can realize continuous magnetron sputtering of multiple layers of films; and the method can save the film plating time and improve the film plating efficiency.

Description

technical field [0001] The invention belongs to the field of magnetron sputtering technology (Magnetron Sputtering), and in particular relates to a magnetron sputtering device and a magnetron sputtering method. Background technique [0002] At present, the magnetron sputtering coating technology has been developed relatively mature, and has the advantages of fast deposition speed, low substrate temperature rise, and many types of sputtering targets. The deposited film has high purity, small damage, good compactness, and uniformity. Excellent, strong adhesion, good process repeatability and other series of advantages. In addition, magnetron sputtering technology is favored by thin film manufacturers because of its relatively simple device, precise control of film thickness, and easy industrialization. With the rapid development of the flat panel display industry, optical memory industry and solar cell industry, people put forward requirements for large-area coating technolog...

AI Technical Summary

Problems solved by technology

With the rapid development of the flat panel display industry, optical memory industry and solar cell industry, people put forward requirements for large-area coating technology, mainly facing three problems: 1) The uniformity of the film (including film thickness, film composition, etc.) is difficult control

2) The repeatability of the film production process is difficult to control

3) The multi-layer thin film process technology faces many difficulties, including multi-cavity vacuum technology, substrate transfer technology, ultra-clean film preparation environment and high cost

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