SMD type PTC thermistor preparation method

A thermistor and graphite technology, which is applied in the field of preparation of SMD type PTC thermistor, can solve the problems of large structure size and achieve the effect of increasing line density, reducing area and easy promotion

Inactive Publication Date: 2016-05-04
SHAANXI SHENGMAI PETROLEUM
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

Due to the limitations of the manufacturing process and processing equipment, the traditional lead-shaped overcurrent protection element makes its structural size too large to meet the requirements of the existing process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] A kind of preparation method of SMD type PTC thermistor, with BaTiO 3 , SrCO 3 , MnO 2 , Y 2 o 3 , SiO 2 Mix it with graphite to prepare the material, use a 200kg ball mill for ball milling, and use agate balls as the ball milling medium; then pre-fire, the pre-fire process uses a tunnel furnace, and the pre-fire temperature reaches 1250°C; then granulate, and then carry out After pressing and molding, it is sintered in a bell furnace, and finally the electrodes are welded by reflow soldering to make a thermistor.

[0013] According to a method for preparing an SMD type PTC thermistor according to the present invention, the content of the graphite is 1% to 5%. The specification of the molding is 9.3mm×1.65mm. The particle size of the graphite is 10 μm. A large amount of graphite powder is mixed into the formula, mainly to generate a small amount of pores during the sintering process, so as to relax the huge stress generated by the ceramic chip when it is subjecte...

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PUM

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Abstract

The invention relates to a SMD type PTC thermistor preparation method, and belongs to the field of electronic component preparation. The preparation method comprises: mixing BaTiO3, SrCO3, MnO2, Y2O3, SiO2 and graphite to prepare a spare material, and carrying out ball milling by using a 200 kg mill ball, wherein the ball milling media uses agate balls; pre-burning, wherein the pre-burning process uses a tunnel furnace; granulating, carrying out pressing molding after completing the granulating, and sintering by using a bell furnace; and finally welding an electrode by using a reflux welding manner to prepare the thermistor. According to the present invention, through the process improvement, the small size sheet-like surface adhesion type ceramic overcurrent protection element is prepared, such that the area of the circuit board is substantially reduced, the assembly process is simplified, and the circuit density is improved; and by adding the graphite, the micro-pores are formed in the ceramic so as to increase current resistant of the ceramic sheet.

Description

technical field [0001] The invention belongs to the field of preparation of electronic components, in particular to a preparation method of an SMD type PTC thermistor. Background technique [0002] With the continuous advancement of science and technology, the communication industry is facing fierce market competition. In order to meet the market requirements, equipment manufacturers continue to introduce new products. One of the development trends is to make the circuit board as small as possible, continuously simplify the production process, and continuously improve product performance. . Due to the limitations of the manufacturing process and processing equipment of the traditional lead-shaped overcurrent protection element, its structural size is too large to meet the requirements of the existing process. Contents of the invention [0003] The present invention aims to solve the above problems, and provides a method for preparing an SMD type PTC thermistor. [0004] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/468C04B35/622
Inventor 王耀斌
Owner SHAANXI SHENGMAI PETROLEUM
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