Continuous phase-change heat sink thermal control unit

Abstract

The invention discloses a continuous phase-change heat sink thermal control unit, and aims at providing a thermal control unit for a phase-change material, which is simple in principle and low in implementation cost. The continuous phase-change heat sink thermal control unit is achieved through the technical scheme as follows: a conical spring for supporting a pre-tightening pressure plate is arranged at the bottom end of a closed cavity of a closed shell; the phase-change material is arranged between a thermal diffusion plate and the pre-tightening pressure plate; the phase-change material is closely pressed on the thermal diffusion plate by pre-tightening force of the conical spring; a heat source is transferred to the phase-change material for phase change through the thermal diffusion plate in the phase change process; the phase-change material on the interface of the phase-change material and the thermal diffusion plate is softened; the conical spring transfers the pre-tightening force of the spring to the interface of the phase-change material and the thermal diffusion plate through the pre-tightening pressure plate; and the softened and molten phase-change material is pushed out of the interface of the thermal diffusion plate and the phase-change material, and is eliminated to one side of the conical spring from a gap between the pre-tightening pressure plate and the closed shell, so that the phase change material is thinned under the action of the spring force of the conical spring; continuous melting phase change of continuously thinning is generated; and efficient heat transfer and energy storage are achieved.

Description

technical field [0001] The invention relates to a phase change heat sink which utilizes the principle of phase change heat transfer to transfer heat to electronic equipment. Background technique [0002] With the high frequency and high speed of electronic devices and the rapid development of integrated circuit technology and technological progress, the total power density of electronic components has increased significantly while the physical size has become smaller and smaller, and the heat flux has also increased. Therefore, high temperature The temperature environment will inevitably affect the performance of electronic components, which requires more efficient thermal control. Therefore, effectively solving the heat dissipation problem of electronic components has become a key technology in the manufacture of electronic components and electronic equipment. With the rapid development of microelectronics technology, the miniaturization of electronic devices has become th...

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Problems solved by technology

[0003] The purpose of the present invention is to aim at the deficiencies of the existing technology, to provide a continuous phase change heat sink heat control unit with simple principle, low cost and phase change materials, so as to overcome the high cost of traditional modified phase change materials and technical problems. Difficult implementation and poor technical economy

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