Prepreg and method for manufacturing the same

Abstract

The invention relates to a prepreg and a method for manufacturing the same. The prepreg comprises a core, a second resin material and a third resin material. A first resin material is immersed in the core, the second resin material is stacked on the top of the core, the third resin material is stacked on the bottom of the core, and an interface is formed between a bending part of the core and the first resin material.

Description

[0001] The domestic priority application and foreign priority application claimed and incorporated by reference are as follows: This application claims the benefit of Korean Patent Application No. 10-2014-0135596 filed on October 8, 2014, the disclosure of which Korean application This application is incorporated by reference in its entirety. technical field [0002] The present invention relates to a prepreg capable of realizing high functions and a manufacturing method thereof. Background technique [0003] Due to the development of electronic device manufacturing technology, printed circuit boards that must be integrated in electronic devices have also been required to be lightweight, slim, and compact. Since the insulating layers that insulate the wiring layers from the intermediate layers used to connect the circuits are stacked alternately in the printed circuit board, the wiring layers are mainly made of metal materials such as copper, and the insulating layers are ma...

AI Technical Summary

Problems solved by technology

However, since the inorganic filler protrudes to the surface of the prepreg, the bonding strength of the wiring deteriorates during the process of forming the wiring on the prepreg

And, if the fine wiring pattern is realized by the SAP process, there is a limit to forming the fine wiring pattern due to the increased surface roughness after the desmear process

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