A partition pressurization device and method suitable for large single-sided grinding and polishing equipment

Abstract

The invention relates to a partition pressing device and method suitable for a large single-face grinding polishing device. The partition pressing device comprising an outer ring pressing mechanism and an inner ring pressing mechanism is connected with a control mechanism, and the control mechanism is connected with a pneumatic mechanism; the outer ring pressing mechanism comprises an air cylinder connected with the pneumatic mechanism, and the air cylinder is connected with a grinding polishing assembly through a first transmission mechanism; and the inner ring pressing mechanism comprises a rotary connector connected with the pneumatic mechanism, the rotary connector is connected with a second transmission mechanism arranged in the first transmission mechanism, the second transmission mechanism is connected with a center grinding plate, and the center grinding plate can be movably arranged in the center of the bottom of the grinding polishing assembly. According to the partition pressing device and method, the outer ring pressing mechanism conducts overall pressing, and the inner ring pressing mechanism conducts center part pressing, so that the condition that a whole disc of wafers are poor in consistency due to different linear velocities caused by different diameters is avoided; the outer ring finished product wafers and the inner ring finished product wafers on a ceramic disc are high in consistency, the grinding polishing accuracy is high, the production efficiency is greatly improved, and the percent of pass of the finished products is improved.

Description

technical field [0001] The invention belongs to the technical field of machine tools, devices or processes for grinding or polishing, and particularly relates to a method of controlling the pressure at different positions of the grinding body and realizing the uniform thickness of the finished workpiece after grinding and polishing through the pressure difference between the blocks. , Good consistency, suitable for partition pressurization device and method of large single-side grinding and polishing equipment. Background technique [0002] Single-sided grinding and polishing equipment is a high-precision surface processing equipment with high-strength mechanical structure and stable precision. It is mainly used for quartz crystal sheets, silicon, germanium sheets, glass, ceramic sheets, piston rings, valve plates, valve plates, Single-sided grinding and polishing of bearings, molybdenum sheets, sapphires, various sheet metals and other disc parts, and non-metallic parts. ...

AI Technical Summary

Problems solved by technology

[0004] However, in the existing technology, the requirements for single-side grinding and polishing equipment are getting higher and higher, and the demand for products is also large. This will inevitably require the use of large-scale grinding and polishing equipment to complete the work, but if the same technology is used in large On the grinding and polishing equipment, during the working process, the grinding and polishing of the wafer is realized by the relative movement between the grinding and polishing assembly and the lower grinding disc. When the diameter of the ceramic disc is different, the linear speed will increase as the diameter becomes larger , so that the final wafer will appear thicker in the inner layer of the ceramic disc and thinner in the outer layer, which affects the consistency of the entire wafer. The larger the diameter difference of the ceramic disc, the greater the consistency error of grinding and polishing. It will be bigger, which will seriously affect the grinding and polishing accuracy, reduce production efficiency, and greatly increase the failure rate

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