Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A Modeling Method for the Intensive Model of Surface Potentials of Ⅲ-ⅴ Hemt

A modeling method and surface potential technology, applied in the fields of instrumentation, calculation, electrical digital data processing, etc., can solve the problems that the charge equation cannot be integrated, cannot be simulated by nonlinear circuits, and segment points are not continuous

Active Publication Date: 2018-10-19
HANGZHOU DIANZI UNIV
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to address the shortcomings of the existing III-V group HEMT device modeling technology, to provide a modeling method for the III-V group HEMT surface potential base intensive model, aiming to solve the existing III-V group The current and charge equations of HEMT devices cannot be integrated, the segment points are discontinuous, and they cannot be used for nonlinear circuit simulation, etc. Establish an accurate III-V HEMT intensive model

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A Modeling Method for the Intensive Model of Surface Potentials of Ⅲ-ⅴ Hemt
  • A Modeling Method for the Intensive Model of Surface Potentials of Ⅲ-ⅴ Hemt
  • A Modeling Method for the Intensive Model of Surface Potentials of Ⅲ-ⅴ Hemt

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0063] The present invention will be further tested, verified and analyzed below in conjunction with the accompanying drawings and specific examples.

[0064] The AlGaN / GaN HEMT device is an important representative of the III-V HEMT device. The present invention carries out intensive model building and model parameter extraction for the depleted AlGaN / GaN HEMT device with 2 gate fingers, 0.25um gate length and 10um gate width. , Die test data provided by CLP Group. Such as figure 1 As shown, the modeling method of the AlGaN / GaN HEMT surface potential basis intensive model includes the following steps;

[0065] Step 1. Establish an AlGaN / GaN HEMT surface potential basis intensive kernel model:

[0066] 1.1 Write the unique polarization and quantum effects of AlGaN / GaN HEMT devices into the two-dimensional Poisson equation, derive the surface potential equation of AlGaN / GaN HEMT devices, realize the characterization of different structures of the device, and establish the sur...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a modelling method for a surface potential basis intensive model of an III-V group HEMT (High Electron Mobility Transistor). The method comprises the following steps of firstly, establishing an intrinsic structure model and an extrinsic structure model of the III-V group HEMT, combining a physical structure and a behavior mechanism of a device to construct a topological structure, and then embedding the established models into a commercial EDA (Electronic Design Automation) tool; secondly, carrying out on-wafer testing on an actual depletion device to obtain various performance test data of the device; and lastly, verifying the intensive model. The model solves the problems that the existing current and charge equations of the device cannot integrate, the segment points are discontinuous and the equations cannot be used for nonlinear circuit simulation; through a method for solving a surface potential source equation to deduce model current and charge / capacitance equations, a physical problem for quantum effect processing and a numerical algorithm problem caused by simultaneous self-consistent solution of a classic carrier transport equation and a new effect in the existing physical model are solved; and furthermore, a computational formula for volume charge density is deducted again, so that a problem of difficulty in gluing in a charge model is solved.

Description

technical field [0001] The invention relates to a microelectronic device modeling technology, in particular to a modeling method of a III-V family HEMT surface potential basis intensive model. Background technique [0002] III-Ⅴ group high electron mobility transistor (HEMT) is recognized as the most competitive three-terminal device in the field of microwave / millimeter wave devices and circuits. At present, low-noise amplifiers and power amplifiers made of III-Ⅴ HMET have been Widely used in satellite receiving systems, electronic radar systems and optical fiber communication systems. However, as the basis of microwave monolithic integrated circuit computer-aided design (MMIC CAD), the III-V HEMT device models suitable for large-scale electronic design automation (EDA) simulation applications are still scarce, and the development of modeling technology lags behind. The feasibility and accuracy of the model and modeling technology are the key to the success of MMIC CAD. Th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
CPCG06F30/39G06F30/398
Inventor 汪洁刘军孙玲玲
Owner HANGZHOU DIANZI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products