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Core filling method for solder wire soldering flux

A technology of flux and solder wire, applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of high cost and low efficiency of tin wire, improve production efficiency, reduce production cost, and make production simple Effect

Active Publication Date: 2016-03-23
SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, it is necessary to provide a simple, low-cost and effective soldering flux core filling method for the above-mentioned problems of high cost and low efficiency in making sample tin wire

Method used

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  • Core filling method for solder wire soldering flux
  • Core filling method for solder wire soldering flux
  • Core filling method for solder wire soldering flux

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0051] A solder wire sample with an alloy composition of Sn-Cu0.7 and a flux content of 1.9%±0.2% was prepared.

[0052] Step 1: If Figure 7 As shown, select a hollow tin tube 1 of Sn-Cu0.7 alloy and put it into the hollow tin tube placement frame 2; the length of the hollow tin tube 1 is about 1.2 meters, and the outer diameter is Inner diameter is take one The small round rod of the hollow tin tube 1 and the small hole on the top of the hollow tin tube rack 2 are used to play the role of positioning pins. At this time, pay attention to the gap between the tin tube through hole 11 at the bottom of the hollow tin tube 1 and the taper tip 22. ~2cm distance. Check whether the tin tube through-hole 11 of the hollow tin tube 1 can be accurately stuck on the taper tip 22 when the small round rod is pulled out, and if not, it will be adjusted.

[0053] Step 2: Heat the rosin flux container to be filled to 135-145 degrees;

[0054] Step 3: If Figure 8 As shown, the tin tub...

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Abstract

The invention relates to the technical field of welding, and specifically discloses a core filling method for a solder wire soldering flux. The method comprises steps of positioning and placing a hollow tin tube before manufacturing, heating a soldering flux, heating a tin-tube heating barrel and a rosin heating barrel, preserving heat, filling core, and cooling, so as to wrap the soldering flux in tin alloys. The core filling method is simple in manufacturing, and would not disturb normal operation of a workshop production line, and is suitable for small-scale production of solder wire samples. The method improves production efficiency and reduces production cost.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a core filling method for solder wire flux. Background technique [0002] During the decades of rapid development of electronic assembly technology, solder wire has been widely used. Judging from the current technological development, solder wire will still be an important solder in electronic assembly for a long time. [0003] The most critical process of manufacturing solder wire is to wrap the flux into the tin alloy to obtain the initial wire billet, and the wire billet is finally made into the required external dimensions, that is, solder wires of various diameters. In the prior art, the process of encapsulating the flux into the solder alloy can only be realized on a special tin wire extruder. Due to the different methods of adjusting the amount of flux cored, the extruder has a fixed shape and size type rosin nozzle and an adjustable type. These two kinds of structures o...

Claims

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Application Information

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IPC IPC(8): B23K35/40
CPCB23K35/40
Inventor 杜昆段德春陈明汉赵锦业覃启新
Owner SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
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