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A bga placement system

A mounting system and mounting technology, applied in the direction of assembling printed circuits with electrical components, electrical components, printed circuit manufacturing, etc., can solve the problems of manual mounting of IC devices such as BGA, etc., to solve the problems of precise mounting and operation. High precision and reliable performance

Active Publication Date: 2018-01-05
SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem solved by the present invention: with the development trend of miniaturization, portability and multi-functionalization of electronic products, IC chips in different packaging forms such as BGA develop towards the direction of increasing the number of pins and reducing the pin spacing , which makes it difficult to manually mount BGA and other IC devices in sample production or small batch production

Method used

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  • A bga placement system
  • A bga placement system
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Examples

Experimental program
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Embodiment Construction

[0054] Such as figure 1 , a BGA placement system, comprising a placement mechanism a, and a PCB board positioning adjustment mechanism b.

[0055] combine Figure 2 to Figure 5 , the mounting mechanism a includes a mounting frame a10, the mounting frame includes a pair of vertical mounting support plates a11, the top of the mounting support plate is fixedly installed with a crossbeam a13, and the crossbeam is provided with There is a horizontal slideway, the sliding block a14 is slidably fitted on the horizontal slideway, the drive unit that drives the sliding block to move along the horizontal slideway is installed on the beam, the mounting assembly a20 is installed on the sliding block, and the mounting assembly It includes a picking mechanism for picking up BGA devices and an alignment adjustment mechanism for adjusting the alignment of the picking mechanism; both sides of the mounting frame are provided with BGA storage tables a30 for placing BGA devices to be mounted.

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Abstract

The invention discloses a BGA surface mounting system which comprises a surface mounting mechanism and a PCB positioning and adjusting mechanism. The PCB positioning and adjusting mechanism is placed under a crossbeam, and comprises a vertical and horizontal adjusting device and a positioning clamp mounted on the vertical and horizontal adjusting device; and in the positioning clamp, a fixation disk and locking blocks move up and down simultaneously to clamp a PCB on the fixation plate; the vertical and horizontal adjusting device moves the positioning clamp vertically and horizontally, so that BGA devices are in up and down correspondence with pad positions on the BCB, and then, reflow soldering is carried out. According to the technical scheme, the BGA surface mounting system is simple and reasonable in structure, convenient to install, simple in use and operation and high in working efficiency, the problem that BGA devices are hard to surface mount accurately on the PCB is effectively solved, the work performance is reliable, and the operation precision is high.

Description

Technical field: [0001] The invention relates to a system for placing components such as BGA and CSP welded on a PCB, that is, an electronic printing board. Background technique: [0002] With the miniaturization (such as mobile phones), portability (such as notebook computers) and multi-functional development trends of electronic products, the functions of integrated circuits are becoming stronger and stronger. At the same time, BGA (BallGrid Array ball grid array structure), IC chips in different packages such as CSP (chip scale package) and QFP (Quad Flat Package) are developing in the direction of increasing the number of pins and reducing the pin pitch, which gives a lot to the sample production process. Or manual placement of BGA and other IC devices in small batch production brings difficulties. However, the fully automatic placement machine suitable for mass production is uneconomical for sample production and small batch production. Invention content: [0003] T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K3/341H05K2203/1509
Inventor 王荣沈祺舜
Owner SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD
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