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Array substrate and manufacturing method thereof, display panel, display device

A technology for an array substrate and a manufacturing method, which is applied in the fields of an array substrate and its manufacturing method, a display device, and a display panel, and can solve problems such as uneven diffusion, reduce a drop, solve uneven diffusion of PI in an alignment layer, and improve display quality Effect

Active Publication Date: 2019-01-18
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The invention provides an array substrate and its manufacturing method, a display panel, and a display device, which are used to reduce the gap between the upper surface of the via hole in the array substrate and the transparent conductive layer around the via hole, thereby solving the uneven diffusion of PI in the alignment layer problem, improve display quality

Method used

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  • Array substrate and manufacturing method thereof, display panel, display device
  • Array substrate and manufacturing method thereof, display panel, display device
  • Array substrate and manufacturing method thereof, display panel, display device

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Embodiment 1

[0043] see figure 1 , a method for manufacturing an array substrate provided by an embodiment of the present invention, the method includes:

[0044] S101, using a patterning process to form a via hole for connecting the second transparent conductive layer and the gate line layer, a via hole for connecting the second transparent conductive layer and the source-drain electrode layer, and a via hole for connecting the first via holes in the transparent conductive layer and the second transparent conductive layer;

[0045] S102 , while forming the pattern of the second transparent conductive layer, perform filling and leveling processing on the via hole, so that the top surface of the filled via hole is at the same level as the second transparent conductive layer around the via hole.

[0046]It should be noted that the first transparent conductive layer in the embodiment of the present invention refers to the common electrode layer, and the second transparent conductive layer re...

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Abstract

The invention discloses an array substrate and a manufacturing method thereof, a display panel and a display device, which are used to reduce the gap between the upper surface of the via hole in the array substrate and the transparent conductive layer around the via hole, so as to solve the problem of alignment layer polyimide The problem of uneven diffusion of thin film PI can improve the display quality. The manufacturing method of the array substrate is characterized in that the method comprises: forming a via hole for connecting the second transparent conductive layer and the gate line layer on the base substrate by using a patterning process, and forming a via hole for connecting the second transparent conductive layer and the The via hole of the source-drain electrode layer and the via hole used to connect the first transparent conductive layer and the second transparent conductive layer; while forming the pattern of the second transparent conductive layer, the via hole is filled and leveled, so that the filled The upper surface of the flattened via hole is at the same level as the second transparent conductive layer around the via hole.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate and a manufacturing method thereof, a display panel, and a display device. Background technique [0002] In the manufacturing process of thin film transistor liquid crystal display panel (TFT-LCD), holes need to be drilled inside and around the panel (Panel), for example, for connecting the transparent conductive layer (ITO) and the grid line layer, or connecting the transparent conductive layer and Source-drain metal, or a via hole connecting the transparent conductive layer and the common electrode line. Moreover, due to the uneven morphology in the via hole and the surrounding area of ​​the via hole, the alignment layer polyimide film (PolyimideFilm, PI) is coated, and the problem of uneven diffusion of PI in the alignment layer occurs, which seriously affects the local area of ​​the display area. Displays the picture quality of the screen. For ex...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/77G02F1/1362
CPCG02F1/133345H01L27/124G02F1/136227G02F1/136286G02F1/136236G02F1/13439G02F1/1368G02F2201/121G02F2201/123
Inventor 白金超郭会斌刘耀丁向前
Owner BOE TECH GRP CO LTD
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