Optical imaging method

Abstract

The invention discloses an optical imaging method which is characterized in that resolution of a camera within an effective view field range of three-dimensional imaging and the dimension of structured light stripe width B, interval W and step b in a projected image after being subjected to projection and amplification within the effective view field range of three-dimensional imaging are calculated in advance by adopting a parallel translation area array stripe scanning mode; in the effective view field range of three-dimensional imaging, the dimension of the structured light stripe width B, interval W and step b generated by a projector and after being subjected to projection and amplification is equal to or larger than the minimum resolution of the camera in the direction of structured light stripe width; and high-resolution three-dimensional imaging of a detected object is realized through accumulated calculation. The optical imaging method realizes high-resolution three-dimensional imaging of the detected object, and can be used for designing and manufacturing high-resolution three-dimensional surface sensors which are simple in structure, small in size, simple in information processing and low in cost.

Description

technical field [0001] The invention relates to an optical imaging method. Background technique [0002] Optical three-dimensional imaging technology is an important part of machine vision research. As the "eye" of automation technology, it has extremely wide applications in many fields. The high-resolution optical three-dimensional imaging system can obtain more three-dimensional data on the surface of the measured object within the effective field of view composed of the projection light path of the projection device and the receiving light path of the camera, so as to achieve the goal of high sampling accuracy in three-dimensional space . At present, the following high-resolution optical three-dimensional imaging methods are used in the field of active machine vision and have their own problems: (1) The method of increasing the number of projected structured light fringes is adopted. When the number of projected fringes increases, the number of single projected fringes ...

AI Technical Summary

Problems solved by technology

At present, the following high-resolution optical three-dimensional imaging methods are used in the field of active machine vision and have their own problems: (1) The method of increasing the number of projected structured light fringes is adopted. When the number of projected fringes increases, the number of single projected fringes The narrower the width, it is limited by the imaging resolution of the imaging device itself and the front and rear occlusion of the unevenness of the object itself. When the number of stripes is too large or the width of a single structured light stripe is too narrow, it is very difficult for the computer to identify and the subsequent processing is complicated.

(2) The method of moving the optical three-dimensional imaging device or moving the measured object requires a large volume and high precision mechanical scanning device, resulting in a large volume, complex structure and high cost of the entire imaging system

(3) The method of changing the projection optical path of the projection device or the receiving optical path of the imaging device by rotating the swinging mirror, due to the addition of an optical scanning device, the system structure is complicated

(4) With the method of interpolation and subdivision, the follow-up processing is complicated, and the data obtained by interpolation and the actual data have certain errors

(5) Although the phase shift method can also obtain a high-resolution 3D surface shape, it needs to know the phase of the reference surface, the calculation process is very complicated, and there is a crossover error

However, the structure of the above-mentioned device is relatively complicated, the quality of the laser itself and its installation are very high, the manufacturing and processing of the device are difficult, and the cost is high.

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