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A heat sink for electronic components with a triangular cross-section

A heat sink, triangular technology, applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating transformation, etc., can solve the problems of affecting heat dissipation, uneven temperature of the heat sink, and affecting the service life of the heat sink, so as to ensure the life of the heat sink, Improve heat dissipation efficiency and uniform heat dissipation

Active Publication Date: 2017-10-20
石家庄锐创电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the heat sinks are all the same in thickness, which makes the heat dissipation of the whole heat sink uneven. Affect the service life of the radiator

Method used

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  • A heat sink for electronic components with a triangular cross-section
  • A heat sink for electronic components with a triangular cross-section
  • A heat sink for electronic components with a triangular cross-section

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Embodiment Construction

[0028] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0029] In this article, if there is no special explanation, when it comes to formulas, " / " means division, and "×" and "*" mean multiplication.

[0030] Such as figure 1 , 2 As shown, a heat sink for electronic components, the heat sink includes a base 1 and fins 3-5 located on the periphery of the base, such as figure 1 , 2 As shown, the cross section of the base body is an isosceles triangle, and the fins include a first fin 3 and a second fin 4, 5, and the first fin 3 extends outward from the apex of the isosceles triangle Yes, the second fins 4, 5 include a plurality of fins 4 extending outward from the face where the two waists of the isosceles triangle are located and a plurality of fins 5 extending outward from the first fin, in the same direction The extended second fins 4, 5 are parallel to each other, for example, as shown in...

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Abstract

The invention provides a heat sink for electronic devices with a triangular cross-section. The heat sink includes a base body and fins located on the periphery of the base body. The cross-section of the base body is an isosceles triangle. The first fin and the second fin extending outward from the corner, the second fin includes a plurality of fins extending outward from the face where the two waists of the isosceles triangle are located and a plurality of fins extending outward from the first fin A plurality of fins, the second fins extending in the same direction are parallel to each other, the extended ends of the first fins and the second fins form a second isosceles triangle; the surface where the base of the isosceles triangle is located In thermal contact with heat sinks of electronic components. The invention optimizes the structure of the radiator, and sets the structure of the radiator according to the law of heat distribution, so as to maximize the heat dissipation efficiency.

Description

technical field [0001] The invention belongs to the field of radiators, in particular to a radiator used for heat dissipation of electronic components, and belongs to the field of F28F. Background technique [0002] With the rapid development of electronic technology, the running speed of heating electronic components such as the central processing unit is getting faster and faster, and the heat generated during operation also increases accordingly. In order to dissipate the heat to ensure the normal operation of electronic components, it is necessary to For heat dissipation, the quality of the heat dissipation is directly related to the life of the computer and the quality of the calculation. As the main frequency of electronic components is getting higher and higher, the heat generation is also increasing. If the large amount of heat generated by electronic components cannot be dissipated in time, its working performance will be seriously affected. Therefore, preventing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 高燕宇邓洪高孙少帅韩桂明刘栋李飞李哲孙甜甜柴成
Owner 石家庄锐创电子科技有限公司
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