Small ball head tool single-turntable polishing machining device and tool setting method

A processing device and tool technology, which is applied in the field of small ball head tool single turntable grinding and polishing processing device, can solve the problems of low tool efficiency, difficult to achieve high-precision tool setting, long tool setting time, etc., and achieve high-efficiency tool setting adjustment Effect

Active Publication Date: 2016-01-13
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention solves the increasingly high requirement for tool setting accuracy of machine tools for processing small-sized parts in the prior art. It is difficult to achieve high-precision tool setting with an automatic tool setting instrument. Due to the lack of spatial position reference in the inclined-axis machining movement form of a single turntable, The mechanical method requires a long time for tool setting to adjust the position of the grinding and polishing tool head, which has the problem of low tool setting efficiency, and then proposes a single turntable grinding and polishing processing device for small ball head tools and a tool setting method

Method used

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  • Small ball head tool single-turntable polishing machining device and tool setting method
  • Small ball head tool single-turntable polishing machining device and tool setting method
  • Small ball head tool single-turntable polishing machining device and tool setting method

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specific Embodiment approach 1

[0031] Specific implementation mode one: combine figure 1 Describe this embodiment, a small ball head tool single turntable grinding and polishing processing device and tool setting method, the device includes a horizontal platform 1, a workpiece spindle 3, a first CCD camera 5, a small ball head grinding and polishing tool 6, a grinding Throwing tool spindle 7, spindle clamping part 8, bevel fixed seat 9, centering adjustment displacement table 10, turntable 11, connecting plate 13, V-direction roller guide rail 14, U-direction roller guide rail 15, U-direction adjustment micrometer Head 16, V adjust micrometer head 17, the second CCD camera 18 and two magnifying lens 4; One magnifying lens 4 is installed on the first CCD camera 5, and another magnifying lens 4 is installed on the second CCD camera 18, The workpiece 2 is installed on the workpiece spindle 3, the first CCD camera 5, the second CCD camera 18 and the workpiece spindle 3 are arranged on the horizontal platform, t...

specific Embodiment approach 2

[0033] Specific implementation mode two: combination Figure 1-Figure 4 , Figure 7 Describe this embodiment, a small ball head tool single turntable grinding and polishing processing device and tool setting method, the centering adjustment and tool setting method of the tool relative to the turntable is realized according to the following steps:

[0034] Use the first CCD camera 5 to obtain the tool setting image of the small ball head polishing tool 6 in the tool setting area, first set the swing angle θ of the turntable 11 to 90° and -90°, and process the tool setting image captured by the first CCD camera 5 Image, obtain the pixel coordinates of the center point of the small ball head polishing tool 6 in the image, and obtain the centering deviation value of the center point of the small ball head polishing tool 6 in the direction of the V-direction roller guide rail 14 according to the calibration coefficient of the image system δ, and eliminate the deviation by fine-tun...

specific Embodiment approach 3

[0045] Specific implementation mode three: combination figure 1 , Figure 4-Figure 7 Describe this embodiment, a small ball head tool single turntable grinding and polishing processing device and tool setting method, the tool setting method of the tool relative to the workpiece is realized according to the following steps:

[0046] First, the second CCD camera 18 is used to obtain the image of the tool setting area from the X-axis direction to obtain the relative position deviation between the center of the tool head and the workpiece axis in the Y and Z directions, and then the first CCD camera 5 is used to obtain the image of the tool from the Y-axis direction. The position deviation of the head center relative to the end surface of the workpiece in the X direction, and then the CNC axis of the machine tool drives the workpiece 2 and the tool system to move along the X, Y, and Z directions respectively to adjust the tool and the workpiece 2 to the origin of the machining pro...

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Abstract

The invention discloses a small ball head tool single-turntable polishing machining device and tool setting method and relates to a small ball head tool single-turntable polishing machining device, centering adjustment and tool setting method for a tool relative to a turntable and a tool setting method for the tool relative to a workpiece. The problems that high-precision tool setting is difficult for machining a small-sized part through a machine tool in the prior art, the tool setting time is very long to adjust the position of a polishing tool head through a mechanical method and the tool setting efficiency is low are solved. The small ball head tool single-turntable polishing machining device comprises a horizontal table, a workpiece spindle, a first charge coupled device (CCD) camera, a small ball head polishing tool, a polishing tool spindle, a spindle clamping member, a bevel angle fixing base, a centering adjustment displacement table, the turntable, a connecting plate, a V-direction pin roller guiding rail, a U-direction pin roller guiding rail, a U-direction adjusting micrometer head, a V-direction adjusting micrometer head, a second CCD camera and two enlarging lenses. The small ball head tool single-turntable polishing machining device is used for setting the tool of the machine tool for the small-sized part.

Description

technical field [0001] The invention relates to a small ball head tool single turntable grinding and polishing processing device and a tool setting method. Background technique [0002] With the increasing development of modern science and technology, in the fields of national defense, aerospace and electronics, biomedicine and other fields, various high-precision and high-surface-quality small-diameter special-shaped parts are widely used. The surface shape of these parts requires sub-micron-level shape accuracy, nano-level surface roughness, and minimal sub-surface damage. Ultra-precision polishing is required to meet the requirements for precision and surface quality. [0003] For the ultra-precision machining of such complex surface-shaped parts with small curvature radius, it is necessary to use small-sized special polishing tool heads, combined with corresponding structural processing equipment, in order to meet the position and motion relationship conditions required ...

Claims

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Application Information

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IPC IPC(8): B24B37/00B24B37/34B24B49/12
CPCB24B37/00B24B37/34B24B49/12
Inventor 陈明君刘赫男吴春亚程健王廷章陈妮方针余波
Owner HARBIN INST OF TECH
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