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Photocurable thermosetting resin composition, cured product, and printed circuit board

A resin composition, thermosetting technology, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve the increasing requirements for high sensitivity of solder mask, and it is difficult to improve sensitivity, developability and finger touch. Dryness, high amount of epoxy resin added, etc., to achieve the effect of excellent touch dryness

Active Publication Date: 2019-10-01
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the amount of epoxy resin added is large, the sensitivity decreases and the reactivity by heat becomes better, which may cause a decrease in developability.
[0004] In addition, in recent years, due to the trend of improving productivity caused by the introduction of exposure machines for laser direct imaging, for example, the demand for higher sensitivity of solder resist films has increased. dry composition

Method used

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  • Photocurable thermosetting resin composition, cured product, and printed circuit board
  • Photocurable thermosetting resin composition, cured product, and printed circuit board
  • Photocurable thermosetting resin composition, cured product, and printed circuit board

Examples

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Embodiment

[0147] Examples and comparative examples are shown below, and the present invention will be specifically described, but the present invention is of course not limited to the following description. In addition, the following "parts" and "%" mean "parts by mass" and "% by mass" unless otherwise specified.

[0148] [Synthesis of photosensitive resin]

Synthetic example 1

[0149] Synthesis Example 1: Carboxyl-containing resin (A-1)

[0150] In 600 g of diethylene glycol monoethyl ether acetate, 1070 g of o-cresol novolak type epoxy resin [manufactured by DIC Corporation, EPICLON N-695, softening point 95° C., epoxy equivalent 214, average number of functional groups 7.6] 1070 g ( The number of glycidyl groups (total number of aromatic rings): 5.0 moles), 360 g (5.0 moles) of acrylic acid, and 1.5 g of hydroquinone were heated to 100° C. and stirred to dissolve uniformly.

[0151] Next, 4.3 g of triphenylphosphine was charged, heated to 110° C., and reacted for 2 hours, then heated up to 120° C., and further reacted for 12 hours. In the obtained reaction solution, 415 g of aromatic hydrocarbons (Solvesso 150) and 456.0 g (3.0 moles) of tetrahydrophthalic anhydride were dropped into, reacted for 4 hours at 110° C., and cooled to obtain a carboxyl group-containing photosensitive resin solution ( A-1).

[0152] The solid content (the amount exclud...

Synthetic example 2

[0153] Synthesis Example 2: Carboxyl-containing resin (A-2)

[0154] In 700 g of diethylene glycol monoethyl ether acetate, 1070 g of o-cresol novolak type epoxy resin [manufactured by DIC Corporation, EPICLON N-695, softening point 95° C., epoxy equivalent 214, average number of functional groups 7.6] 1070 g ( The number of glycidyl groups (total number of aromatic rings): 5.0 moles), 360 g (5.0 moles) of acrylic acid, and 1.5 g of hydroquinone were heated to 100° C. and stirred to dissolve uniformly.

[0155] Next, 4.3 g of triphenylphosphine was charged, heated to 110° C., and reacted for 2 hours, and then 1.6 g of triphenylphosphine was further added, and the temperature was raised to 120° C., and the reaction was further performed for 12 hours. 562 g of aromatic hydrocarbons (Solvesso 150) and 684 g (4.5 mol) of tetrahydrophthalic anhydride were put into the obtained reaction liquid, and it reacted at 110 degreeC for 4 hours. Furthermore, 142.0 g (1.0 mol) of glycidyl me...

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Abstract

A photocurable thermosetting resin composition characterized by comprising: (A) a carboxyl group-containing resin, (B) a polyfunctional epoxy resin having a softening point of 60°C or less, (B') a softening point exceeding 60°C (C) photopolymerization initiator and (D) colorant, (B) epoxy group (B1) and (B') softening point of multifunctional epoxy resin with softening point below 60°C The sum of the epoxy groups (B'1) of the polyfunctional epoxy resin exceeding 60°C is 0.8 equivalents or more and 2.2 equivalents or less with respect to 1 equivalent of carboxyl groups of the (A) carboxyl group-containing resin, and the aforementioned photocurable thermosetting resin is used The transmittance at a wavelength of 600 nm of a dried coating film having a film thickness of 20 μm formed from the composition is 25% or less.

Description

technical field [0001] The present invention relates to a photocurable thermosetting resin composition, a cured product, and a printed wiring board. Background technique [0002] Conventionally, as a solder resist film material for a printed circuit board, a photocurable thermosetting resin composition containing a photosensitive resin, a photopolymerization initiator, and an epoxy resin as a thermosetting resin is known (for example, refer to Patent Literature 1, 2, etc.). Adhesiveness can be further improved by adding an epoxy resin, and it is expected to impart characteristics such as chemical resistance, heat resistance, dry-to-touch property, or electrical insulation. In addition, when the photosensitive resin is contained and the epoxy resin is not contained, or when the added amount of the photosensitive resin is larger than that of the epoxy resin, curing shrinkage may occur, but by controlling the added amount of the epoxy resin, the curing can be suppressed. shri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/032C08G59/42G03F7/004G03F7/038H05K3/28
CPCC08G59/42G03F7/038H05K3/287H05K3/3452G03F7/40
Inventor 植田千穂
Owner TAIYO HLDG CO LTD
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