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Magnetic-core Three-dimensional (3d) Inductors And Packaging Integration

A 3D, three-dimensional technology, applied in the field of magnetic core three-dimensional inductors and package integration, can solve problems such as power loss power integration

Active Publication Date: 2015-12-23
AVAGO TECH INT SALES PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the high current that needs to be fed to the PCB or to the substrate traces connected to the chip's power supply pins can create issues with power loss and power integration

Method used

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  • Magnetic-core Three-dimensional (3d) Inductors And Packaging Integration
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  • Magnetic-core Three-dimensional (3d) Inductors And Packaging Integration

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Embodiment Construction

[0044] The detailed description set forth below is intended as a description of various configurations of the subject technology and is not intended to represent the only configurations in which the subject technology may be implemented. The accompanying drawings are incorporated herein and form part of the detailed description. The detailed description includes specific details to provide a thorough understanding of the subject technology. It will be clear and obvious to one skilled in the art, however, that the subject technology is not limited to the specific details set forth herein and can be practiced using one or more implementations. In one or more instances, well-known structures and components are shown in block diagram form in order to avoid obscuring the concepts of the subject technology.

[0045] In one or more aspects of the subject technology, methods and implementations are described for providing magnetic core 3D inductors with integrated 3D inductor circuit...

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Abstract

A 3-dimensinal (3-D) magnetic core device includes a substrate, a first magnetic shell formed on the substrate, and a first group of conductive traces embedded in a first insulator layer formed on the first magnetic shell. A magnetic core plane is formed on the first insulator layer, and a second group of conductive traces are embedded in a second insulator layer formed on the magnetic core plane. A second magnetic shell is formed on the second insulator layer, and the first and second group of conductive traces are conductively coupled by using conductive vias.

Description

[0001] Cross References to Related Applications [0002] This application claims U.S. Provisional Patent Application 61 / 980,565, filed April 16, 2014, U.S. Provisional Patent Application 62 / 062,716, filed October 10, 2014, and The benefit of priority to U.S. Provisional Patent Application 62 / 114,489, filed February 10, is hereby incorporated by reference in its entirety. technical field [0003] The subject technology relates generally to integrated circuits and, in particular, to magnetic core three-dimensional (3D) inductors and package integration. Background technique [0004] Inductors are placed in circuits with one or more semiconductor devices to perform actions such as filtering and RF matching. Inductors typically contain one or more turns of conductor surrounding an air or magnetic core, and the inductance value is proportional to the amount of magnetic field coupled to the multiple turns of conductor due to the alternating current flowing through the conductor. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F37/00H01F41/00H01L23/522H01L23/64
CPCH01F17/0013H01F41/046H01F2017/0053H01F2017/0066H01F2027/2809H01L2224/16225H01L2224/16227H01L2924/15311H01L2924/15192H01L2924/19105H01L2924/19042H01L2924/19104H05K1/181H01F17/045H01F38/14
Inventor 雷佐尔·拉赫曼·卡恩彼得·沃伦坎普桑帕施·克马拉帕拉亚姆·韦拉于德哈姆·卡里卡兰赵子群爱德华·劳尼尔·安德鲁·基斯特勒
Owner AVAGO TECH INT SALES PTE LTD
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