Dry etching machine table and application method thereof

Abstract

The invention discloses a dry etching machine table and an application method thereof, which belongs to the technical field of display and can be used for solving the technical problem of non-ideal surface temperature uniformity of a substrate during dry etching process. The dry etching machine table comprises a sealed process cavity for dry etching on the substrate, an upper-part electrode, a lower-part electrode, a plurality of temperature sensors and a cooling controller are arranged in the process cavity, the upper-part electrode is arranged at the top of the cavity, the lower-part electrode is arranged at the bottom of the cavity and is opposite to the upper-part electrode, the plurality of temperature sensors are arranged on the upper surface of the lower-part electrode, the cooling controller comprises a plurality of gas nozzles and a processor, one of the gas nozzles is arranged near each temperature sensor, when the substrate is placed on the lower-part electrode, the temperature sensors contact the lower surface of the substrate and are used for detecting the temperature of the substrate at the position where the temperature sensors are located and transmitting temperature values of the detected substrate to the cooling controller, and the processor of the cooling controller is used for controlling gas flow of each gas nozzle according to the temperature value detected by each temperature sensor at the same time.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a dry etching machine and a method for using the same. Background technique [0002] In the current manufacturing process of the array substrate of the liquid crystal display panel, the etching part is divided into wet etching and dry etching. Among them, in the dry etching part, the process chamber of the dry etching machine is mainly composed of the upper electrode, the lower electrode and the process chamber wall. [0003] Under the existing temperature control method, the surface temperature uniformity of the lower electrode is not ideal. In the manufacturing process of the array substrate, the substrate (such as a glass substrate) is fixed on the surface of the lower electrode by a DC power supply, and affected by the lower electrode, the surface temperature uniformity of the substrate is not ideal, which affects the uniformity of etching. In addition, the photoresist at ...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a dry etching machine and its use method, which can improve the technical problem of unsatisfactory surface temperature uniformity of the substrate during the dry etching process

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