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MEMS technology preparation method of piezoelectret matrix

A piezoelectric electret and matrix technology, which is applied in the process of producing decorative surface effects, metal material coating process, decorative art, etc., can solve the problem of low preparation efficiency and achieve the effect of free and flexible regulation

Active Publication Date: 2015-11-11
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The latter cannot form a multilayer piezoelectric electret matrix in the film thickness direction, and the preparation efficiency is extremely low

Method used

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  • MEMS technology preparation method of piezoelectret matrix
  • MEMS technology preparation method of piezoelectret matrix
  • MEMS technology preparation method of piezoelectret matrix

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Embodiment Construction

[0028] The present invention will be further described through the embodiments below in conjunction with the accompanying drawings.

[0029] The preparation method of the MEMS process of the piezoelectric electret substrate of the present embodiment, comprises the following steps:

[0030] 1) Provide the substrate 1, the material is Si, and the thickness is 400 μm, such as figure 1 shown;

[0031] 2) Spin-coat photoresist 2 on the substrate. The photoresist is AZP4620 with a thickness of 7 μm. Use a hot oven to soft-bake the photoresist at a temperature of 150 ° C for 25 minutes. figure 2 shown;

[0032] 3) According to the pattern of the holes of the required piezoelectric electret substrate designed on the first photoresist plate, the pattern of the first photoresist plate is transferred to the photoresist by ultraviolet exposure, the exposure time is 9 seconds, and the development time is 1.5 seconds. Minutes, just can form the figure 21 of required hole on photoresist...

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Abstract

The invention discloses an MEMS technology preparation method of a piezoelectret matrix. According to the preparation method, a standard MEMS micromachining process is used, and a first photoetching plate is used to form a groove with a high aspect ratio, and the groove is filled with functional piezoelectret matrix material; a second photoetching plate is used to form an opening window, and the piezoelectret matrix under the opening window is finally released so as to achieve consistency and controllability of the shape of the hole on the piezoelectret, wherein the minimum controllable size is in 1 microns magnitude. The preparation method of the invention can efficiently prepare the multilayer piezoelectret matrix in a film thickness direction, and the number of layers is not less than 50. The preparation method of the invention achieves the goal of freely and flexibly adjusting the geometric dimension of the hole and the number of layers and the geometric dimension of the piezoelectret matrix by designing the photoetching plate.

Description

technical field [0001] The invention relates to micromachining preparation technology, in particular to a method for preparing a piezoelectric electret matrix with MEMS technology. Background technique [0002] Piezoelectric electret is a new type of flexible porous electret with strong piezoelectric effect. Its piezoelectric constant d 33 It can reach hundreds of pC / N, and its piezoelectric performance is comparable to that of traditional piezoelectric ceramic materials. It is widely used in the field of micro-electromechanical systems, especially in acoustic / vibration / pressure sensors. The piezoelectric electret includes the piezoelectric electret matrix and the polarized charges on its surface. The piezoelectric electret matrix is ​​a porous structure, and there are polarized charges attached near the holes of the piezoelectric electret matrix; under the action of external force , the shape of the piezoelectric electret changes, resulting in a piezoelectric effect. The...

Claims

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Application Information

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IPC IPC(8): B81C1/00
Inventor 冯跃
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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