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Integral molding method of earphone case and integrally formed earphone case

A molding method and the technology of earphone sets, which are applied in the direction of earpiece/earphone accessories, etc., can solve the problems that the earphone sets cannot realize the automatic production of equipment, affect the overall benefit and living environment of the enterprise, and the output of voltage process is low, so as to improve the brand reputation, The effect of improving the level of green environmental protection, improving product reliability and production efficiency

Active Publication Date: 2018-02-06
东莞洋京实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above two processes are complex, labor-intensive, and manual operation leads to poor product consistency, which makes it difficult to achieve standardization. In addition, the voltage process has great restrictions on the physical properties of materials, poor versatility, and the voltage process has low output and high production costs.
Due to the poor consistency of products, it is difficult to achieve standardization. Therefore, the production of earphone sets cannot realize the automatic production of equipment, which seriously affects the overall benefits and living environment of enterprises and even industries.

Method used

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  • Integral molding method of earphone case and integrally formed earphone case
  • Integral molding method of earphone case and integrally formed earphone case
  • Integral molding method of earphone case and integrally formed earphone case

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] Such as figure 1 , Figure 5 and Figure 6 As shown, on the one hand, there is provided an integrated molding method for earphone covers, comprising the following steps:

[0070] Provide molds;

[0071] Provide a foaming agent, and pour the foaming agent into the cavity 31 of the mould;

[0072] Provide a snap-in limiter 2, fix the snap-in limiter 2 at the opening position of the mold cavity 31, and place the foaming agent in the cavity 31 and the snap-in limiter 2 inside the enclosed cavity;

[0073] Clamping and foaming;

[0074] Demoulding and taking out the earphone cover from the cavity 31 of the mould;

[0075] De-edge and edge-trimming are performed on the earphone cover;

[0076] quality inspection;

[0077] Pack the box.

[0078] Specifically, the foaming agent and the clamping limiting member 2 are placed together in the mold, and the foaming agent is combined with the clamping limiting member 2 in the process of foaming and forming The integrated st...

Embodiment 2

[0085] Such as figure 2 As shown, on the one hand, there is provided an integrated molding method for earphone covers, comprising the following steps:

[0086] Provide molds;

[0087] providing a foaming agent, pouring the foaming agent into the cavity of the mould;

[0088] Provide a snap-in limiter, fix the snap-in limiter at the opening position of the mold cavity, place the foaming agent in the cavity surrounded by the cavity and the snap-in limiter cavity;

[0089] Clamping and foaming;

[0090] Demoulding and taking out the earphone cover from the cavity of the mould;

[0091] De-edge and edge-trimming are performed on the earphone cover;

[0092] quality inspection;

[0093] Pack the box.

[0094] In this embodiment, the mold includes an upper mold and a lower mold that are oppositely arranged, the upper mold and the lower mold selectively abut to form a closed cavity, and the lower mold is provided with the mold cavity. The opening position of the mold cavity ...

Embodiment 3

[0104] Such as image 3 As shown, on the one hand, there is provided an integrated molding method for earphone covers, comprising the following steps:

[0105] Provide molds;

[0106] providing a foaming agent, pouring the foaming agent into the cavity of the mould;

[0107] Provide a snap-in limiter, fix the snap-in limiter at the opening position of the mold cavity, place the foaming agent in the cavity surrounded by the cavity and the snap-in limiter cavity;

[0108] Clamping and foaming;

[0109] Demoulding and taking out the earphone cover from the cavity of the mould;

[0110] De-edge and edge-trimming are performed on the earphone cover;

[0111] quality inspection;

[0112] Pack the box.

[0113] In this embodiment, the mold includes an upper mold and a lower mold that are oppositely arranged, the upper mold and the lower mold selectively abut to form a closed cavity, and the lower mold is provided with the mold cavity. The opening position of the mold cavity is ...

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PUM

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Abstract

The invention discloses an integral molding method of an earphone cover, comprising the following steps: providing a mould; providing a foaming agent, pouring the foaming agent into a cavity of the mould; providing a clamping stopper, fixing the clamping stopper on The opening position of the mold cavity allows the foaming agent to be placed in the cavity surrounded by the cavity and the clamping stopper; mold closing and foaming. The integrated molding method of the earphone cover realizes the integrated molding of the earphone cover, removes complicated production processes, simplifies the production process, and relieves the dependence of product production on labor, thereby improving product consistency and facilitating standardized automatic production of products. Product reliability and production efficiency. In addition, the present invention also discloses an integrally formed earphone cover, which can effectively improve product consistency and production efficiency by providing an integrally formed main body and clamping stoppers, and the earphone cover of this solution does not need to use leather materials, which improves the earphone cover. The level of green environmental protection, while avoiding waste and pollution of leather tailings.

Description

technical field [0001] The invention relates to the technical field of earphones and earmuffs for hearing protection equipment, in particular to a method for manufacturing an earphone set and the earphone set, and further relates to an integral molding method of the earphone set and the integrally formed earphone set. Background technique [0002] With the widespread popularity of computers and handheld mobile terminals, the demand for the related earphone industry has also expanded rapidly and is constantly developing in the direction of high quality. [0003] At present, the traditional earphone process methods include sewing process and voltage process. The sewing process needs to first cut the leather and sponge according to the required size, then use special equipment to sew the leather, then fill the leather with sponge and seal and sew the dust-proof net, and finally put the earphone sleeve on when assembling with the earphone On the plastic positioning part of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C44/04B29C44/16B29C44/18H04R1/10
Inventor 黄成波
Owner 东莞洋京实业有限公司
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