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Full-wave band terahertz frequency tripling module

A terahertz, full-band technology, applied in electrical components, power oscillators, etc., can solve the problems of high cost, poor integration, complex system, etc., to reduce production costs, improve circuit bandwidth performance, and facilitate system integration.

Active Publication Date: 2015-11-04
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these technologies have problems such as system complexity, poor integration, and high cost.

Method used

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  • Full-wave band terahertz frequency tripling module
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  • Full-wave band terahertz frequency tripling module

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Embodiment Construction

[0021] The embodiments of the present invention are described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following implementation example.

[0022] Such as Figure 1~3 As shown, this embodiment includes a metal upper base 1 and a metal lower base 2, and the cavity formed by the metal upper base 1 and the metal lower base 2 is respectively provided with a matching waveguide 3 and a chip channel 4 with the same structure. terminals are respectively connected to the matching waveguide 5 at the output end and the matching waveguide 3 at the input end, and the frequency doubling chip 7 in the chip channel 4 is bonded to the metal upper base 1 . In order to realize connection with other external components, connecting flanges 8 are provided on both sides of ...

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Abstract

The invention discloses a full-wave band terahertz frequency tripling module. The full-wave band terahertz frequency tripling module comprises a metal upper base and a metal lower base, wherein input-end matched waveguides, chip channels and output-end matched waveguides of the same structures are arranged in cavities formed by the metal upper base and the metal lower base respectively; terahertz full-wave band frequency doubling chips are arranged in the chip channels; the terahertz full-wave band frequency doubling chips are bonded on the metal upper base; and the terahertz full-wave band frequency doubling chips are connected with the input-end matched waveguides and the output-end matched waveguides respectively. The full-wave band terahertz frequency tripling module is based on a terahertz integrated circuit micro-nano manufacturing technology, and has the characteristics of compact structure, easiness and convenience in installation, high integration degree, full-wave bandwidth, no need of extra bias, low cost, high consistence and convenience in large-scale manufacturing.

Description

technical field [0001] The invention belongs to the technical field of micro-nano preparation based on terahertz integrated circuits, and in particular relates to a full-band terahertz frequency tripler module. Background technique [0002] Terahertz waves (Terahertz, THz for short) generally refer to electromagnetic waves with a frequency in the range of 0.1 THz to 10 THz (wavelength of 30 μm to 3 mm). 1THz (10 12 Hz) corresponds to a wave number of 33.3cm -1 , the energy is 4.1meV, and the wavelength is 300μm. From the perspective of spectrum, terahertz waves are between microwave and infrared in the electromagnetic spectrum, in the transition zone from electronics to photonics, and in the transition zone from macroscopic classical theory to microscopic quantum theory. In the field of electronics, terahertz waves are called submillimeter waves; in the field of optics, they are also called far-infrared rays; in terms of energy, the energy of terahertz waves is between el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03B19/14
Inventor 杨非王宗新孟洪福孙忠良
Owner SOUTHEAST UNIV
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