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Gradient-enhanced ceramic particle Cu heat sink and preparation method thereof

A ceramic particle and gradient technology is applied in the field of ceramic particle gradient enhanced Cu heat sink and its preparation, which can solve the problem that the thermal expansion coefficients of chip materials cannot be matched at the same time, and achieve the effects of improving service life, low preparation temperature and cost saving.

Inactive Publication Date: 2015-11-04
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention solves the problem that the thermal expansion coefficients of the heat sink and various chip materials cannot be matched simultaneously in the prior art, introduces the concept of functional gradient into the Cu heat sink, and provides a ceramic particle gradient enhanced Cu heat sink and its preparation method

Method used

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  • Gradient-enhanced ceramic particle Cu heat sink and preparation method thereof
  • Gradient-enhanced ceramic particle Cu heat sink and preparation method thereof
  • Gradient-enhanced ceramic particle Cu heat sink and preparation method thereof

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preparation example Construction

[0035] The preparation method of the above-mentioned ceramic particle gradient reinforced Cu heat sink mainly includes two stages of green compact preparation and sintering to prepare the heat sink. The sintering preparation of the heat sink is divided into three processes: preheating, reaction and densification, specifically including the following steps:

[0036] Step 1. Compaction preparation:

[0037] Weigh 2 or 3 groups of 40-80vol.% Cu powder and 20-60vol.% reactant powder for preparing ceramic particles and add them to the mixer respectively, after mixing evenly, add them to the mold respectively, and press to form, obtain compacts of 2 or 3 different compositions;

[0038] Among them, the reactant powder used to prepare ceramic particles is a mixture of Ti powder and B powder, or Ti powder and B powder 4 The mixture of C powder, when the reactant powder is a mixture of Ti powder and B powder, the material ratio of Ti powder and B powder is 1:2; when the reactant powde...

Embodiment 1

[0054] Gradient reinforced Cu heat sink with ceramic particles, the composition of the first functional layer is: 40vol.%TiB 2 / Cu; the composition of the second functional layer is: 20vol.%TiB 2 / Cu.

[0055] above TiB 2 Preparation method of ceramic particle gradient reinforced Cu heat sink:

[0056] Step 1. Put 74.83g of Cu powder with a particle size of 45μm, 17.26g of Ti powder with a particle size of 20μm, and 7.91g of B powder with a particle size of 1μm into a mixer (rotating at a speed of 10r / min) for 7 hours; mix 88.80g Cu powder with a particle size of 50 μm, 7.68 g of Ti powder with a particle size of 25 μm, and 3.52 g of B powder with a particle size of 5 μm were put into a mixer (rotating speed: 50 r / min) and mixed for 6 hours; The materials are respectively put into stainless steel molds and pressed into billets;

[0057] Step 2. Stack the two compacts in the graphite mold in the sintering furnace. After vacuuming, inject 1 atmosphere of high-purity nitrogen...

Embodiment 2

[0062] Ceramic particle gradient reinforced Cu heat sink, the composition of the first functional layer is: 60vol.%TiB 2 -TiC / Cu; the composition of the second functional layer is: 50vol.%TiB 2 -TiC / Cu; the composition of the third functional layer is: 40vol.%TiB 2 -TiC / Cu.

[0063] The aforementioned TiC-TiB 2 Preparation method of ceramic particle gradient reinforced Cu heat sink:

[0064] Step 1: 56.13g of Cu powder with a particle size of 45μm, 31.70g of Ti powder with a particle size of 3.5μm and 12.17g of B with a particle size of 5μm 4 Put the C powder into the mixer (30r / min) and mix for 7 hours; put 65.74g of Cu powder with a particle size of 25μm, 24.75g of Ti powder with a particle size of 25μm and 9.51g of B with a particle size of 3.5μm 4 Put C powder into the mixer (rotating speed is 40r / min) and mix for 8 hours; 74.22g of Cu powder with a particle size of 25μm, 18.63g of Ti powder with a particle size of 20μm and 7.15g of B with a particle size of 5μm 4 C p...

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Abstract

The invention relates to a gradient-enhanced ceramic particle Cu heat sink and a preparation method thereof, and belongs to the technical field of chip packaging and heat radiating of semiconductor lasers. The problem that the thermal expansion coefficient of an existing heat sink cannot be matched with the thermal expansion coefficients of various chip materials at the same time is solved. The heat sink is composed of two layers of structures or three layers of structures. Each layer of structure is composed of 20-60 vol.% of ceramic particles and 40-80 vol.% of Cu. The ceramic particles are a mixture of TiB2 or TiB2-TiC. According to the heat sink, the contents of the ceramic particles in all the layers are different, and the corresponding thermal expansion coefficients are different, so that chips are welded to the functional layers with the thermal expansion coefficients matched with the thermal expansion coefficients of the chips during packaging application; the thermal expansion coefficients of the chips of a semiconductor laser are matched with the thermal expansion coefficients of the functional layers, and therefore the welding internal stress between the chips and the heat sink is lowered and the service life of the semiconductor laser is prolonged. Due to the fact that the heat sink is provided with the functional layers with different thermal expansion coefficients, the packaging use requirements of the chips with different thermal expansion coefficients can be met at the same time. The preparation technology is simple and convenient, cost is low, and application and popularization are easy.

Description

technical field [0001] The invention belongs to the technical field of semiconductor laser chip packaging and heat dissipation, and in particular relates to a ceramic particle gradient enhanced Cu heat sink and a preparation method thereof. Background technique [0002] Semiconductor lasers have extremely important applications in all-solid-state laser pumping, laser processing, space telecommunication, medical equipment, and military defense. At present, it is developing rapidly in the direction of high integration, high power and high performance. What follows is that the influence of its thermal effect is becoming more and more obvious, so the heat sink, which plays a role in packaging and cooling the laser chip, is also facing greater challenges. The relationship between its thermal conductivity and its thermal expansion coefficient and the matching degree of the chip to the reliability and service life of the laser. Therefore, it is urgent to develop a new heat sink w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C32/00
Inventor 舒世立佟存柱吴昊汪丽杰田思聪王立军
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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