A new technology of LED packaging

Abstract

The invention discloses a novel LED packaging process comprising the steps of chip testing, chip expansion, glue dispensing, glue preparation, manual chip stabbing, automatic chip mounting, sintering, and glue-dispensing packaging. Silica gel is used as die bonding glue in glue-dispensing packaging, the die bonding glue is used for die bonding through glue dispensing heads, and the glue dispensing heads are of a variety of sizes and shapes. The glue dispensing heads can be shaped as a single rectangle, a graph formed by splicing a rectangle and two semicircles with the short side of the rectangle as the diameter, a circle, or a square; the glue dispensing heads can be shaped as two parallel squares or two parallel circles; and the glue dispensing heads can be shaped as four squares in uniform square array or four circles in uniform square array. According to the invention, the glue dispensing heads of a variety of sizes and shapes are adopted for glue-dispensing packaging, so that the consumption of die bonding glue is reduced, the thickness of die bonding glue is reduced, and the heat conduction effect of silica gel is improved. An LED lamp bead produced by the process of the invention has the characteristics of high light efficiency, long service life, and environment-friendliness.

Description

technical field [0001] The invention relates to the field of LED lamps, in particular to a new LED packaging process. Background technique [0002] There are many different materials for the base of high-power lamp beads, which mainly include PLCC, ceramic base and MCPCB (aluminum substrate, copper substrate), while PLCC mainly includes patch 3535 (0.5~1.5W), 5050 (1W~2W), imitation Lumens 1 ~ 3W and multi-chip modules (above 3W). Outdoor street lights mainly use ceramic base 3535, ceramic base 5050, PLCC imitation lumens and multi-chip modules (above 30W). [0003] At present, the high-power lamp beads on the market use silver glue with high thermal conductivity, while low-power lamp beads use silica gel with low thermal conductivity. Usually, the crystal-bonding glue used in high-power lamp beads is silver glue, but silver glue has the following disadvantages: [0004] 1. The main components of silver glue are silver powder and epoxy resin. The matching between epoxy re...

AI Technical Summary

Problems solved by technology

[0004] 1. The main components of silver glue are silver powder and epoxy resin. The matching between epoxy resin in silver glue and encapsulation glue (silica gel) is not good, and the sealing performance is poor;

[0005] 2. The thermal resistance of lamp beads using silver glue as the crystal-bonding glue tends to increase during use, that is, the thermal conductivity becomes worse;

[0006] 3. The reflective ability of silver glue to light is poor, and it is difficult to improve the light efficiency of lamp beads

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