Experiment method for measuring asynchronous curing degree distribution of transparent resin material

Abstract

The invention belongs to the technical field of experimental mechanics and non-contact optical measurement, and relates to an experiment method for measuring asynchronous curing degree distribution of a transparent resin material. By the adoption of the coherent gradient sensing method, curing degree distribution of the transparent resin material is measured in real time. According to the method, firstly, the transparent material is contained in a transparent container before curing; then, the container is placed in a heating furnace, wherein the front and the back of the heating furnace are provided with windows; then, the heating furnace is placed in a coherent gradient sensing measurement optical path, interference fringes caused by change of the curing degree of the material are shot in real time through a CCD camera, and accordingly relevant information of curing degree distribution of the material is obtained. The adopted coherent gradient sensing technology is optical non-contact measurement. Compared with a traditional DSC method, the measured material does not need to be contacted, interference on curing of the measured material is reduced, and asynchronous curing can be monitored globally.

Description

technical field [0001] The invention belongs to the technical field of experimental mechanics and non-contact optical measurement, and relates to an experimental method for measuring the asynchronous curing degree distribution of transparent resin materials. Background technique [0002] The classical analysis methods for curing residual stress and deformation of composite laminates are implicitly based on a basic assumption: the curing thermal history and curing reaction of each ply in the board are completely synchronized. Under this assumption, the laminates with symmetrical ply design do not warp after curing. However, in the real curing process, due to the existence of the temperature gradient in the board, the simultaneous curing of each layer cannot be realized, and the residual stress and the deformation state of the board are largely determined by the specific curing process. At present, the monitoring of the curing process and the distribution of the curing degree...

AI Technical Summary

Problems solved by technology

However, in the real curing process, due to the existence of the temperature gradient in the board, the simultaneous curing of each layer cannot be realized in practice, and the residual stress and the deformation state of the board are largely determined by the specific curing process.

At present, the monitoring of the curing process and the distribution of the curing degree in the board mainly relies on the DSC method. This method needs to arrange sensors in the sample to be tested. At the same time, the measured value is the average value of the overall curing degree, so this method cannot monitor the inside of the material. Uneven curing everywhere caused by asynchronous curing

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