Method for checking internal circuit structure of encapsulated circuit components

Abstract

The invention relates to a method for checking the internal circuit structure of encapsulated circuit components. The method comprises the steps that firstly, a solution is prepared, wherein a mixed solution is prepared according to the volume ratio 1-5:1 of nitric acid and sulfuric acid, the mixed solution is slowly stirred to be even, and the prepared solution is obtained; secondly, resin is melted; wherein the mixed solution obtained in the first step is heated and boiled, the circuit components to be check are put into the mixed solution and taken out after the encapsulation resin on the surfaces of the circuit components are completely melted, the circuit components with the internal circuit structure exposed externally are obtained, and heating is stopped; thirdly, the circuit structure is checked, wherein the circuit components obtained in the second step are put under a microscope to be observed, the circuit structure of the circuit components is check, and whether a fault exists in the circuit structure or not is judged. The method has the advantages that the encapsulation resin of the circuit components is melted through the prepared solution, the original circuit structure is completely reserved, the defect of the circuit structure can be conveniently observed, cost is low, and operation is convenient.

Description

technical field [0001] The invention relates to defect analysis of micro circuit components, in particular to a method for checking the internal circuit structure of packaged circuit components. Background technique [0002] Electronic circuits are composed of various components and various devices. In order to protect the internal circuit structure of the circuit components during use, the circuit structure is usually encapsulated with resin, which plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. At present, the production line of circuit components already includes a packaging step, and the finished product is usually a packaged circuit component. Of course, before getting the finished product, it needs to pass the test. When the test fails, that is, there is a defect in the internal circuit structure, it needs to pass Special testing equipment is used to check the internal circuit structure, so as to facilitate...

AI Technical Summary

Problems solved by technology

[0003] At present, there are many equipments for inspecting the internal structure of packaged circuit components, but most of the equipments used are expensive

Chinese patent: 201110309045.3, specifically discloses an ultrasonic microscopic inspection method, which is used to detect delamination defects inside electronic packaging, and solves the problems caused by environmental temperature and humidity changes, thermal cycles, electromagnetic and stress fields during the use of electronic packaging. Defects that cannot be detected

The principle of ultrasonic internal contrast is that the electric energy generates ultrasonic waves through the focusing conversion mirror and strikes the object to be tested. The sound waves are reflected or penetrated on different interfaces, and the signals are received. After image processing, the images and signals are analyzed. This non-destructive testing method The time-consuming cycle is long, which is not conducive to the rapid delivery of packaged products, and the imaging equipment is expensive and the operation is complicated