A method for improving the uniformity of electroplating layer on pcb vertical electroplating line

Abstract

The invention belongs to the field of circuit board processing, and relates to a method for improving the uniformity of PCB electroplating. The method of the invention changes the position of the anode from being fixed to sliding up and down, thereby eliminating the vertical length difference between the cathode and the anode and ensuring uniform current distribution during the electroplating process. The traditional wiring method of the anode is changed, thereby changing the high and low potential difference of the anode current distribution potential, which is complementary to the high and low potential difference of the current distribution potential of the cathode; the uniformity of the electroplating copper layer is improved, and the copper consumption per unit area is reduced; in electroplating copper During the process, the overall resistance in the electroplating cylinder is relatively balanced, so the power lines in the electroplating cylinder are evenly distributed, thereby effectively eliminating the potential difference between the upper and lower current distribution potentials in the electroplating cylinder; the electroplating copper layer with good uniformity can reduce the difficulty of line etching and achieve The purpose of reducing production scrap rate and improving PCB quality has great market economic value and application prospect.

Description

technical field [0001] The invention belongs to the field of circuit board processing, in particular to a method for improving the uniformity of the electroplating layer of a PCB vertical electroplating line. Background technique [0002] At present, there are two types of PCB electroplating copper technology: soluble anode and insoluble anode. The soluble anode uses titanium blue copper ball as the anode directly, and the insoluble anode uses stainless steel or titanium mesh as the anode. Both methods are passed in the electroplating cylinder. Install anode baffles and cathode floating racks to block high-potential currents so that the overall current distribution is relatively uniform. [0003] In the prior art, soluble anodes have uneven anode area distribution, resulting in relatively poor uniformity of the electroplated copper layer, while insoluble anodes have uniform anode area distribution, and the uniformity of the electroplated copper layer is relatively good. The...

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is to solve the problem of eliminating the current distribution potential difference between the cathode and the anode when they have different length differences.

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