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Low-formaldehyde-content shaving board

A particleboard, low formaldehyde technology, used in aldehyde/ketone condensation polymer adhesives, adhesive types, household components, etc., can solve the problems of low bonding strength, high cost, secondary pollution, etc., and achieve formaldehyde content reduced effect

Inactive Publication Date: 2015-08-19
王良源
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is that the current low-formaldehyde particleboard either has low bonding strength, or is costly and prone to secondary pollution

Method used

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  • Low-formaldehyde-content shaving board
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] 125 parts by weight of wood particle slurry, 10 parts by weight of urea-formaldehyde resin, and 6.5 parts by weight of propyl benzoate are uniformly mixed in a stirring tank, and the mixture is dried at 50-70° C. to a moisture content of 15 wt % to obtain a mixture. The mixture was pre-pressed at 4-5MPa for 30s to form a blank, and the blank was isostatically pressed at 8MPa and 70°C for 1min to form a slab. The slab is hot-pressed, and the hot-pressing conditions are: temperature 160-170°C; rise to 13.5-19MPa within 20-30s, hold pressure for 60-120s; depressurize to 3.5-5.5MPa within 10-15s, hold Press for 65-135s; then rise to 6-8.5MPa within 10-15s, hold the pressure for 50-75s; finally depressurize uniformly to 0MPa within 30-45s. The hot-pressed board was cooled to normal temperature, tempered and sanded to obtain particle board A with a thickness of 25 mm.

[0066] It has been determined that the composition of the particle board A is 85 wt% wood chips, 10 wt% ur...

Embodiment 2

[0068] 167 parts by weight of wood particle slurry, 20 parts by weight of urea-formaldehyde resin, and 11 parts by weight of propyl benzoate were uniformly mixed in a stirring tank, and the mixture was dried at 60-70°C until the water content was 10 wt%, to obtain a mixture. The mixture was pre-pressed at 4-5MPa for 40s to form a blank, and the blank was isostatically pressed at 7MPa and 70°C for 50s to form a slab. The slab is hot-pressed, and the hot-pressing conditions are: temperature 160-170°C; rise to 13.5-19MPa within 20-30s, hold pressure for 60-120s; depressurize to 3.5-5.5MPa within 10-15s, hold Press for 65-135s; then rise to 6-8.5MPa within 10-15s, hold the pressure for 50-75s; finally depressurize uniformly to 0MPa within 30-45s. The hot-pressed board was cooled to normal temperature, tempered and sanded to obtain particle board B with a thickness of 25 mm.

[0069] It has been determined that the composition of the particle board B is 76wt% of wood chips, 15wt% ...

Embodiment 3

[0071] 140 parts by weight of wood particle slurry, 15 parts by weight of modified urea-formaldehyde resin, and 4.5 parts by weight of propyl benzoate were uniformly mixed in a stirring tank, and the mixture was dried at 80° C. until the water content was 10 wt % to obtain a mixture. The mixture is pre-pressed at 4-5MPa for 1min to form a blank, and the blank is isostatically pressed at 7-8MPa and 60-70°C for 50s to form a slab. The slab is hot-pressed, and the hot-pressing conditions are: temperature 160-170°C; rise to 13.5-19MPa within 20-30s, hold pressure for 60-120s; depressurize to 3.5-5.5MPa within 10-15s, hold Press for 65-135s; then rise to 6-8.5MPa within 10-15s, hold the pressure for 50-75s; finally depressurize uniformly to 0MPa within 30-45s. The hot-pressed board was cooled to normal temperature, tempered and sanded to obtain particle board C with a thickness of 25 mm.

[0072] It was determined that the composition of the particle board C was 85 wt% wood chips,...

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Abstract

The invention belongs to the technical field of shaving boards, and relates to a low-formaldehyde-content shaving board. The low-formaldehyde-content shaving board comprises wood chip particles, adhesive and propyl benzoate and is suitable for building, decorating, industrial manufacturing and the like.

Description

technical field [0001] The invention belongs to the technical field of particle boards, in particular to a particle board with low formaldehyde content. Background technique [0002] Formaldehyde is a recognized carcinogen. Scientific research at home and abroad has confirmed that formaldehyde can cause cell apoptosis by regulating DNA expression, cause oxidative damage to biological macromolecules (protein, DNA), and cause cell canceration. [0003] At present, most of the domestically produced particleboards have residual free formaldehyde. The main sources of free formaldehyde are: i. The urea-formaldehyde resin commonly used in the manufacture of particleboard uses formaldehyde as the main raw material, and there will still be unreacted free formaldehyde in the urea-formaldehyde resin; ii. Formaldehyde is released; iii. Hemicellulose in wood gradually decomposes to formaldehyde. The free formaldehyde remaining in the particle board will endanger the health of the human...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N3/02C09J161/24C09J11/04C08G12/12
CPCB27N3/02B27N3/002C08G12/12C08K3/346C08K2201/014C09J11/04C09J161/24
Inventor 王良源
Owner 王良源
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