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Packaging structure for chip nixie tubes used for display screen

A packaging structure and digital tube technology, applied in the field of LED digital display, can solve the problems of increasing product production process, affecting product performance, limiting product volume, etc., to improve heat dissipation and waterproof performance, good stability in use, and easy packaging and storage Effect

Inactive Publication Date: 2015-07-22
SHENZHEN KERUN OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, regardless of the use of large-area heat sinks or active cooling structures such as fans, it will increase the production process of the product, increase the production cost, and limit the volume of the product, affecting the improvement of product performance.

Method used

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  • Packaging structure for chip nixie tubes used for display screen
  • Packaging structure for chip nixie tubes used for display screen

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] figure 1 It shows a packaging structure of a display screen with a chip digital tube in a preferred embodiment of the present invention, while referring to figure 2 , the packaging structure of the display screen with SMD digital tubes includes 16 pieces with an area of ​​4cm 2 A cuboid digital tube package structure unit 1, the multiple digital tube package structure units 1 are arranged in a rectangular array and two adjacent said digital tube package structure units 1 are detachably connected, each said digital tube package The structural unit 1 includes a PCB board 10, a plurality of patch LEDs 20 mounted on the PCB board 10, and a square box 100 for accommodating the PCB board, and the square box 100 includes two sets of side walls parallel to each other , one side wall of each set of side walls is provided with a buckle (not shown), and the other side wall of the set of side walls is provided with a buckle groove (not shown) adapted to the buckle , the buc...

Embodiment 2

[0036] This embodiment provides a packaging structure of a chip digital tube for a display screen, and its structure is consistent with that of Embodiment 1. Particularly preferably, the gap between the nixie tube packaging structural units is filled with an interunit layer, and its raw materials include 70 parts of polyvinyl chloride, 0.3 parts of p-dichlorobenzene, 2 parts of ethylene glycol, 0.9 parts of trimellitic acid tris octyl ester, 2 parts of ferrous sulfate; its preparation method is to add dichlorobenzene in the ethylene glycol and trizinc trimellitic acid, the mixture is heated to 129 °C under three atm, irradiated with 280nm ultraviolet light and Keep it for 10 minutes; heat the above-mentioned polyvinyl chloride to 160°C at 1 atm, add the ferrous sulfate and the mixture and keep it warm for 15 minutes, then inject it into the gap of the digital tube packaging structural unit, and obtain the inter-unit layer after curing .

Embodiment 3

[0038] This embodiment provides a packaging structure of a chip digital tube for a display screen, and its structure is consistent with that of Embodiment 1. Particularly preferably, the gap between the nixie tube packaging structural units is filled with an interunit layer, and its raw materials include 81 parts of polyvinyl chloride, 0.11 parts of p-dichlorobenzene, 4.5 parts of ethylene glycol, 0.7 parts of trimellitic acid tris Octyl esters, 6 parts of ferrous sulfate; the preparation method is to add dichlorobenzene to the ethylene glycol and trimellitic acid trizinc ester, heat the mixture to 118°C at three atm, and use continuous wavelength of 280-310nm Irradiate with ultraviolet light and keep it for 10 minutes; heat the above-mentioned polyvinyl chloride to 153°C at 1 atm, add the ferrous sulfate and the mixture and keep it warm for 15 minutes, inject it into the gap of the digital tube packaging structural unit, and obtain the described interunit layer.

[0039] Fur...

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PUM

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Abstract

The invention provides a packaging structure for chip nixie tubes used for a display screen. The packaging structure comprises a plurality of nixie tube packaging structure units in a cuboid shape, the nixie tube packaging structure units are arranged in a rectangular array shape, every two adjacent nixie tube packaging structure units are detachably connected, and each nixie tube packaging structure unit comprises a PCB, multiple chip LEDs attached to the PCB and a square box used for containing the PCB. The packaging structure has the advantages of being convenient to install and store and capable of meeting the requirements for various sizes of users.

Description

technical field [0001] The invention relates to the field of LED digital display, and more specifically relates to a packaging structure of a chip digital tube for a display screen. Background technique [0002] LED digital tube is a semiconductor light-emitting device. The basic unit is a light-emitting diode. Different pins input relative current to make it light up and display numbers. It is widely used in air conditioners, water heaters, refrigerators and other home appliances. [0003] Most of the packaging structures of SMD digital tubes for display screens in the prior art adopt integrated packaging, which is not conducive to storage and installation when the size is large, and the size cannot be changed. Due to the higher power and higher LED packaging density, the operating temperature of large LED displays tends to be higher. High temperature is likely to cause discoloration and distortion of the display screen, and it is also easy to damage the LEDs packaged in i...

Claims

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Application Information

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IPC IPC(8): G09F9/33
CPCG09F9/33
Inventor 林明
Owner SHENZHEN KERUN OPTOELECTRONICS
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