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Die bonding device of single-sided polisher

A single-sided polishing and sticking technology, applied in the direction of grinding workpiece supports, etc., can solve the problems of complicated operation, high cost, poor quality of sticking, and achieve the effect of reliable workpiece fixation, improving processing accuracy and shortening sticking time.

Inactive Publication Date: 2015-07-08
SUZHOU HRT ELECTRONICS EQUIP TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To solve the defects of poor quality, high cost and cumbersome operation due to the use of adsorption pads or wax sticking methods

Method used

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  • Die bonding device of single-sided polisher
  • Die bonding device of single-sided polisher

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Experimental program
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Embodiment Construction

[0016] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0017] refer to figure 1 As shown, a single-sided polishing machine chip bonding device, the device includes a ceramic disc 2, the upper surface of the ceramic disc 2 is bonded with a holding disc 1, and the holding disc 1 is provided with a plurality of workpieces 3 in size and shape. Matching hole 4, the workpiece 3 is embedded into the holding plate 1 through the hole 4. In this embodiment, after the workpiece 3 is embedded in the holding plate 1, it can be put into the equipment as a whole for single-sided grinding / polishing .

[0018] The working holes 4 are evenly distributed on the end surface of the holding plate 1, and it is advisable that the center of gravity of the embedded workpiece 3 is at the center of the holding plate 1.

[0019] The holding plate 1 is provided with three holes 4, and the holes 4 are distributed at...

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Abstract

The invention discloses a die bonding device of a single-sided polisher. The device comprises a ceramic disk, the upper surface of the ceramic disk is glued with a remaining disk on which a plurality of work-piece holes matched with the sizes and shapes of work-pieces are formed, the work-pieces are embedded into the remaining disk through the work-piece holes, the remaining disk 1 is made from either an epoxy resin glass plate or a blue steel disc, and is directly, firmly and flatly glued with the ceramic disc 2. By adopting the technical scheme provided by the invention, the defects of cushion absorbing and wax pasting can be prevented; furthermore, the work-pieces can be convenient and quick to be placed in the work-piece holes of the remaining disk, and the work-pieces are fixed and reliable, therefore the triviality of wax pasting and the inconsistency defects of the thickness of a wax layer can be saved, the gluing time can be greatly reduced, and the processing precision can be improved; furthermore, the die bonding device is wide in range of application and high in interchangeability.

Description

technical field [0001] The invention relates to the field of single-side polishing / grinding machines, in particular to a single-side polishing machine sticking device. Background technique [0002] Electronic special processing equipment single-sided polishing machine usually adopts two methods of sticking pad or wax. Adopt the method of sticking the adsorption pad to the ceramic plate, and then adsorb the workpiece on the other side of the adsorption pad for processing. The disadvantage of this method is that the adsorption pad is easy to move during the processing, the adsorption is not reliable, and it is easy to produce waste pieces. ;Adopt the method of sticking wax and sticking chips, that is, after heating the wax, stick the workpiece directly on the ceramic plate, and then flatten it, and it can be processed after the wax cools down. The disadvantage of this method is that the waxing process is more complicated, and it needs the assistance of a special waxing machin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B41/06
CPCB24B41/068
Inventor 金万斌李方俊陈丽春
Owner SUZHOU HRT ELECTRONICS EQUIP TECH
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