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Heat radiation and light emitting diode

A technology of light emitting diodes and diodes, applied in the field of diodes, can solve the problems of short service life, single heat dissipation method, low luminous efficiency of light emitting diodes, etc., and achieve the effects of long service life and improved luminous efficiency.

Inactive Publication Date: 2015-07-01
TAICANG TIANYU ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation method of this packaging structure is single, and cannot effectively dissipate the heat generated by the light-emitting diode in a timely and effective manner, so that the luminous efficiency of the light-emitting diode in the prior art is not high and the service life is short.

Method used

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  • Heat radiation and light emitting diode

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Embodiment Construction

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0015] Such as figure 1 As shown, embodiments of the present invention include:

[0016] A heat dissipation light-emitting diode, including a base 1, a base shell 2, a diode 3 located in the base 1, a bonding wire 4, an LED chip 5 and a heat sink 6, and the base shell 2 is installed on the base 1 The bonding wire 4 is connected between the diodes 3 , and the heat sink 6 is mounted on the lower part of the LED chip 5 .

[0017] In the above, the base 1 is provided with positioning holes 11, and the positioning holes...

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Abstract

The invention discloses a heat radiation and light emitting diode. The heat radiation and light emitting diode comprises a base, a base shell, diode bodies, a bonding lead, an LED chip and a heat radiator. The diode bodies, the bonding lead, the LED chip and the heat radiator are arranged in the base. The base shell is arranged on the upper portion of the base, the bonding lead is connected between the diode bodies, and the heat radiator is arranged on the lower portion of the LED chip. In this way, according to the heat radiation and light emitting diode, the heat radiator is added in the base, a lens is arranged in the middle of the upper portion of the base shell, heat generated by the diode can be effectively diffused out in time, the light emitting efficiency of the diode is improved, and the service life is long.

Description

technical field [0001] The invention relates to the field of diodes, in particular to a heat dissipation light-emitting diode. Background technique [0002] The diode packaging structure in the prior art generally consists of a base, a light emitting diode chip and a cover. However, the heat dissipation method of this packaging structure is single, and cannot effectively dissipate the heat generated by the light-emitting diode in a timely and effective manner, which leads to low luminous efficiency and short service life of the light-emitting diode in the prior art. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a heat-dissipating light-emitting diode. A heat sink is added in the base and a lens is installed in the middle of the upper part of the base shell, which can effectively dissipate the heat generated by the diode in a timely and effective manner, and improve the efficiency of the diode. Excellent lumin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V29/70F21Y101/02F21K9/20F21Y115/10
CPCF21K9/00F21V17/12
Inventor 王晓伟陈海林汤健明
Owner TAICANG TIANYU ELECTRONICS
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