Three-dimensional encapsulation surface antenna capable of achieving gap embedding amplitude calibration

Abstract

The invention relates to a horn antenna, in particular to a three-dimensional encapsulation surface antenna capable of achieving gap embedding amplitude calibration. The antenna comprises a metallization perpendicular via hole feeder line (1), a horn antenna body (2) and gaps (3), wherein the metallization perpendicular via hole feeder line (1), the horn antenna body (2) and the gaps (3) are integrated on a dielectric substrate (4) which is located on the topmost face of a three-dimensional encapsulation part (5), and one end of the metallization perpendicular via hole feeder line (1) is connected with an internal circuit (8). The horn antenna body (2) is composed of a bottom face metal plane (6), a top face metal plane (9) and metallization via hole side walls (11), the gaps (3) are formed in the bottom face metal plane (6) and the top face metal plane (9), and four sub-horns are formed in the horn antenna body (2) through the middle gap (17), the left gap (18) and the right gap (19), and electromagnetic wave energy in the antenna is distributed on an antenna aperture face (12) at equal amplitude. The aperture efficiency of the antenna can be improved.

Description

technical field [0001] The invention relates to a horn antenna, in particular to a three-dimensional packaged surface antenna with amplitude calibration embedded in a slot. Background technique [0002] Using micro-assembly technology, a radio frequency system can be placed in a package, for which the antenna also needs to be integrated on the surface of the package. It is a natural way to integrate a patch antenna on the surface of the package, but the main radiation direction of the patch antenna is the normal direction of the surface, and the main radiation direction we sometimes need is along the surface direction. If the horn antenna is integrated on the surface of the package, the radiation along the surface direction can be realized. However, horn antennas are usually non-planar, incompatible with planar circuit technology, and have large geometric dimensions, which limits their application in packaging structures. In recent years, the substrate-integrated waveguide...

AI Technical Summary

Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure

In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration. However, the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. One of the reasons is that the aperture The amplitude of the electromagnetic field on the surface is very uneven, the middle is large and the two sides are small, which affects the radiation performance of the antenna

At present, methods such as dielectric loading and dielectric prisms have been used to correct the asynchronous phase of the horn's aperture surface, but these methods cannot improve the uniformity of the electromagnetic field amplitude distribution on the aperture surface, and these phase alignment structures increase the overall structural size of the antenna. Not suitable for integration into package surface

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