Laser cutting device

Abstract

A laser cutting device (10) is used to cut a short-circuit ring wire of a liquid crystal panel (5). The laser cutting device (10) comprises a laser cutting head (2) used to cut the short-circuit ring wire of the liquid crystal panel (5), and a first detector (3) provided out of the laser cutting head (2) and used to detect the breakage of the edge of the liquid crystal panel (5). The laser cutting device (10) detects the breakage of the edge of the liquid crystal panel (5) by means of the first detector (3), so that the defective liquid crystal panel (5) can be found in time and prevented from flowing into next plant or manufacturer.

Description

technical field [0001] The invention relates to a laser cutting device, in particular to a laser cutting device used for cutting short-circuit ring wiring of a liquid crystal panel. Background technique [0002] With the rapid development of today's society, the automatic production of LCD panels has been promoted to an efficient and high-quality production road. Every link in the production of LCD panels needs to strictly monitor the quality to prevent defective products from flowing into the next workshop or manufacturer. [0003] In the production process of the liquid crystal panel, it is necessary to use the existing laser cutting device to cut the short-circuit ring connection at the edge of the liquid crystal panel, so as to ensure that the liquid crystal panel after installing the IC drive element and the circuit board can operate normally. [0004] However, the existing laser cutting device can use laser to cut the short-circuit ring connection, and detect the disco...

AI Technical Summary

Problems solved by technology

However, the laser cutting device cannot detect the damage at the edge of the liquid crystal panel, so that the defective liquid crystal panels cannot be found, and these defective liquid crystal panels flow into the next workshop or manufacturer

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