Integrated silicon condenser microphone

Abstract

The invention discloses an integrated silicon condenser microphone. The integrated silicon condenser microphone comprises a shell, which is provided with at least one sound inlet hole, a substrate, which is provided with a hole, two or four MEMS (Micro-Elecro-Mechanical System) sensing elements, which are in seamless physical connection, an integrated circuit and sound cavities, wherein the sound cavities are formed by the two or four MEMS sensing elements and the substrate together, specifically, the sound cavities of the two or four MEMS sensing elements are symmetrically communicated through holes in the substrate, and through the symmetrical sound cavities, which are shared and arranged in the shell and are formed by the same sound inlet path relative to the position of each MEMS sensing element, the sound wave is input until a sound transmission path for an electric signal, which is converted by the sound wave through each MEMS sensing element, is fully symmetrical for each MEMS sensing element in the silicon microphone, wherein a sound inlet path is a path formed from the sound inlet hole in the shell to the sound cavities to a vibrating diaphragm of each MEMS sensing element; the integrated circuit is used for buffering / amplifying and outputting the electric signal, which is converted by sending the sound wave to each MEMS sensing element through the sound transmission path.

Description

technical field [0001] The invention relates to the field of microphones, in particular to an integrated silicon capacitor microphone. Background technique [0002] Micro-Electro-Mechanical (MEMS, Micro-Electro-Mechanical System) microphones or silicon microphones are widely used for sound collection of tablet electronic devices due to their small size and suitable for surface mounting, such as mobile phones, MP3, recording pens and monitoring equipment, etc. In order to meet the growing material and cultural needs of the people, the volume, cost, signal-to-noise ratio and other indicators of silicon microphones are constantly being optimized and improved. In related optimization technical solutions, there are many attempts to improve the signal-to-noise ratio index under the existing processing technology conditions by using multiple silicon microphone MEMS sensitive elements together. [0003] The traditional silicon micro-microphone is a single MEMS sensitive element, w...

AI Technical Summary

Problems solved by technology

This makes the existing multi-MEMS sensitive component multiplexing technology face the high cost of separate MEMS packaging if it is compensated, but the way that the MEMS sensitive components are directly connected and connected to the integrated circuit chip cannot compensate the front-end by the chip. The dilemma of reduced data fusion efficiency caused by the mismatch of position and sound transmission path

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