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Camera module and camera equipment provided with same

A technology for camera modules and camera equipment, applied in the field of camera equipment and camera modules, can solve the problems of increasing production costs, large height and size, unable to meet the requirements of lightness, thinness, and shortness, so as to save manufacturing costs, reduce optical length and Effect

Inactive Publication Date: 2015-04-29
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the number of circuit layers increases, the thickness of the corresponding circuit board increases, that is, the height of the entire camera module increases, so the height of the entire camera module is relatively large, which cannot meet the requirements of thinness and shortness, and will increase the production cost accordingly.

Method used

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  • Camera module and camera equipment provided with same
  • Camera module and camera equipment provided with same
  • Camera module and camera equipment provided with same

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see figure 1 A preferred embodiment of the present invention provides a camera module 100 , the camera module 100 includes a lens module 10 , an infrared cut filter 20 , an image sensor 25 and a circuit board 30 . The circuit board 30 includes a first surface 31 and a second surface 32 . A first mounting hole 33 is defined on the first surface 31 . A second installation hole 34 coaxial with and connected to the first installation hole 33 is defined on...

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Abstract

The invention provides a camera module which comprises a lens module, an infrared cut-off filter, an image sensor and a circuit board, wherein the circuit board comprises a first surface and a second surface; a first mounting hole is formed in the first surface; a second mounting hole which is coaxial and communicated with the first mounting hole is formed in the second surface; the diameter of the second mounting hole is larger than that of the first mounting hole; an inverted boss is formed at the periphery of the position, communicated with the first mounting hole, in the second mounting hole; the infrared cut-off filter is accommodated in the first mounting hole; the lens module is assembled to the first surface and located above the first mounting hole; and the image sensor is accommodated in the second mounting hole and fixed and connected with the inverted boss through a conductive adhesive. The invention further provides camera equipment.

Description

technical field [0001] The invention relates to a camera module and an imaging device with the camera module. Background technique [0002] Currently, a traditional camera module includes a lens and a lens mount. Among them, one is that the mirror base is made of a voice coil motor and cooperates with a moving cylinder structure, which can automatically focus. An infrared cut-off filter is arranged in the bracket of the camera module, and the bracket is connected between the circuit board and the voice coil motor. An image sensor is installed between the bracket and the circuit board. The optical length of a lens can be understood as the distance from the upper surface of the first lens of the lens to the photosensitive surface of the imaging sensor. In order to ensure the functional quality of the camera, the height of the image sensor and the lens is immutable; and in order to meet the high pixel requirements of the camera module, the circuit of the image sensor is beco...

Claims

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Application Information

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IPC IPC(8): H04N5/225G02B7/00G03B11/00
Inventor 刘燕妮
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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