Diaphragm device

A diaphragm and diaphragm bag technology, applied in the field of diaphragm devices for insoluble electroplating anodes, can solve the problems of easy aging, copper plating additive consumption, loss of anode protective film coating, etc., to prolong life, reduce reaction probability, and reduce consumption Effect

Active Publication Date: 2015-04-29
UNIMICRON TECH CORP
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

The oxygen released from the anode is easy to react with the copper plating additive added in the electrolyte, so that the copper plating additive is quickly consumed
Moreover, the product of the reaction between the copper plating additive and oxygen will also wear out the protective film coating such as the iridium oxide coating of the anode, making the insoluble electroplating anode easy to age and often need to be replaced

Method used

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Embodiment Construction

[0046] If the oxygen evolved from the insoluble electroplating anode reacts with electroplating-related additives (such as copper plating additives) during the electroplating process, the electroplating additives will be additionally cracked, and the cracked electroplating additives will damage the protective film of the insoluble electroplating anode (such as oxidation iridium coating, etc.), which accelerates the aging of insoluble plating anodes. In order to reduce the probability of the above situation happening. In the present invention, a diaphragm device is provided, which can isolate the electroplating additive from the insoluble electroplating anode, so as to reduce the probability of reaction between oxygen electrolyzed from the insoluble electroplating anode and the electroplating additive, thereby prolonging the service life of the insoluble electroplating anode. The detailed components of the diaphragm device will be introduced in detail below.

[0047] Figure 1...

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Abstract

The invention discloses a diaphragm device which is suitable for an infusible electroplating anode. The diaphragm device comprises a shell and a diaphragm, wherein the shell is provided with a cavity and a first opening communicated with the cavity, the cavity is suitable for accommodating the infusible electroplating anode, and the depth of the cavity is close to the thickness of the infusible electroplating anode. The diaphragm is connected with the first opening. In addition, the invention provides another diaphragm device, wherein the diaphragm device comprises a diaphragm bag body and a back plate. The back plate is configured in the diaphragm bag body, wherein the infusible electroplating anode is suitable for being placed in the diaphragm bag body and is in contact with the back plate.

Description

technical field [0001] The present invention relates to a diaphragm device, and in particular to a diaphragm device for an insoluble electroplating anode. Background technique [0002] The basic process of electroplating is to use the object to be electroplated as the cathode and the metal to be plated as the anode, or, when using an insoluble electroplating anode, the soluble salt of the metal to be plated is added to the electroplating solution. Next, put the cathode and anode in the electroplating solution, and after connecting the DC power supply, the desired coating can be deposited on the object to be electroplated. [0003] Taking the electroplating process of the circuit board as an example, the anode can use a titanium plate or a titanium mesh as an insoluble electroplating anode, and use a copper sulfate solution as an electroplating solution to deposit a copper layer on the cathode. However, during electroplating, the insoluble anode electrode electrolyzes water ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/10
CPCC25D17/10
Inventor 刘邦琼邱昭盛谢章钦吕和荣吴旻骏
Owner UNIMICRON TECH CORP
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