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Thermosetting resin and preparation method thereof

A thermosetting and resin technology, applied in the field of chemical materials, can solve the problems of low temperature resistance and achieve the effects of low volatile matter, strong adhesion, and excellent mechanical properties of the cured product

Inactive Publication Date: 2015-04-29
HENGSHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to overcome the above disadvantages, and provide a thermosetting resin for pultrusion and its preparation method, which can meet the requirements of the pultrusion process, and can be used for a long time at 140 ° C, solving the current problems. Due to the general low temperature resistance of pultruded epoxy resin formulations

Method used

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  • Thermosetting resin and preparation method thereof
  • Thermosetting resin and preparation method thereof

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Embodiment Construction

[0018] In an embodiment, as shown in Table 1, first select CY179, AG80, AFG-90 and D.E.N. TM 425 At least one of these different epoxy resins is used as an epoxy resin mixture, and the epoxy resin mixture and the toughening agent MX960 are uniformly dispersed with a high-speed dispersant at 60°C as component A, and the curing agent MNA, Accelerator 2E4MZ and internal release agent INT-1890 are stirred at high speed at room temperature and dispersed evenly as component B. Mix components A and B evenly at room temperature. / T 2567-1995 Preparation of resin casting body to test its performance.

[0019] CY179 is a cycloaliphatic epoxy resin available as a gift from Huntsman Chemical Company, AG80 is a tetrafunctional epoxy resin obtained from Shanghai Huayi Resin Co., Ltd., and AFG-90 is a trifunctional epoxy resin obtained from Shanghai Huayi Company Epoxy, D.E.N. TM 425 is a liquid novolac epoxy resin obtained from Dow Chemical Company, MNA is a modified methyl nadic anhydrid...

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Abstract

The invention discloses thermosetting resin used for pultrusion and a preparation method of the thermosetting resin. The thermosetting resin is composed of the following components by weight percentage: 35-60% of an epoxy resin mixture, 5-15% of a flexibilizer, 35-60% of a curing agent, 0-10% of a catalyst and 0-3% of an internal releasing agent. The preparation method of the thermosetting resin comprises the following steps: uniformly dispersing the epoxy resin mixture and the flexibilizer to be used as a component A by a high-speed dispersing agent at 60 DEG C, stirring the curing agent, an accelerant and the internal releasing agent at a high speed to uniformly disperse to be used as a component B, uniformly mixing the component A and the component B at normal temperature, and finally defoaming the mixture resin in a vacuum oven to prepare a resin casting body. Compared with unsaturated polyester resin, the thermosetting resin is low in volatile component, low in pollution, good in heat resistance, strong in adhesive force, excellent in mechanical property of a cured material and wide in designable range in terms of temperature tolerance.

Description

technical field [0001] The invention belongs to the field of chemical materials, and in particular relates to a thermosetting resin for pultrusion molding and a preparation method thereof. Background technique [0002] The pultrusion process is the only process that can continuously mechanize the production of fiber-reinforced composite materials. At present, unsaturated polyester is widely used to match glass fibers to prepare various types of materials. With the continuous expansion of applications, the mechanical properties, temperature resistance and environmental friendliness of unsaturated resin systems cannot meet the requirements of use. Contents of the invention [0003] The purpose of the present invention is to overcome the above disadvantages, and provide a thermosetting resin for pultrusion and its preparation method, which can meet the requirements of the pultrusion process, and can be used for a long time at 140 ° C, solving the current problems. Because of...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L101/00C08G59/42C08G59/38C08G59/32C08G59/24
Inventor 毛慧文单瑞俊宋鸿翔马喜静
Owner HENGSHEN
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