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Target welding clamp and target welding method

A technology for welding fixtures and welding methods, which is applied in welding equipment, auxiliary welding equipment, welding/cutting auxiliary equipment, etc., and can solve problems such as poor sputtering surface quality and easy deformation of targets

Active Publication Date: 2015-04-29
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The problem to be solved by the present invention is to provide a target welding fixture and a target welding method, so as to solve the problem of welding seam at the junction of the target and the back plate and the welding of the target and the back plate in the existing target component manufacturing process. During the process, the target is prone to deformation, and the sputtering surface of the target is poor in surface quality.

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  • Target welding clamp and target welding method

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Embodiment Construction

[0055] As mentioned in the background art, in the existing target welding process, the target will be deformed, so further steps such as a leveling process are required to optimize the flatness of the sputtering surface of the target. However, in the actual operation process, if the texture of the target material prepared by the powder metallurgy method is relatively brittle, the target material often breaks during the leveling process, which leads to the scrapping of the target material and affects the yield of the target material.

[0056] Therefore, the present invention provides a target welding jig and a target welding method using the target welding jig. In the process of welding the target blank and the back plate to form the target assembly, the deformation of the target blank can be effectively suppressed, thereby ensuring the flatness of the sputtering surface of the target in the obtained target assembly, and avoiding further damage to the target after the welding pr...

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Abstract

The invention relates to a target welding clamp and a target welding method. The target welding clamp comprises a cover plate and a substrate. The substrate comprises a groove with open upper end; the cover plate covers the groove and a fixing mechanism is arranged between the cover plate and the substrate. In the process of welding a target by using a target welding clamp, a backboard is placed in the groove of the substrate and the welding face of the backboard faces upward, the welding face of a target blank is adhered to the welding face of the backboard, the cover plate covers the groove and presses the target blank, and then a welding process is carried out for forming a target component. According to the technical scheme, the backboard and the target blank can be firmly fixed between the substrate and the cover plate, so that in the welding process, the structures of the backboard and the target blank are retained so as to effectively prevent a sputtering face of the target blank from deformation. Therefore, after welding process, a subsequent leveling treatment process for the target component is not needed, so that the target component is formed in one time, and the target component is prevented from being damaged by the leveling treatment process.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a target welding fixture and a target welding method. Background technique [0002] The target assembly for magnetron sputtering includes a target and a back plate, and the target includes a sputtering surface and a welding surface connected to the back plate. In the magnetron sputtering process, the back plate is fixed on the magnetron sputtering equipment, and charged particles are used to bombard the sputtering surface of the target, so that the target atoms escape from the sputtering surface of the target and deposit evenly on the substrate to form a coating. [0003] Magnetron sputtering has become the most excellent substrate coating process due to its advantages of high sputtering rate, low substrate temperature rise, good film-substrate bonding force, and excellent metal coating uniformity and strong controllability. It is widely used in the coating process of...

Claims

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Application Information

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IPC IPC(8): B23K3/08B23K37/04B23K1/00
CPCB23K3/087B23K2101/40
Inventor 姚力军相原俊夫大岩一彦潘杰王学泽敖林
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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