Full-automatic inductor tin dipping device and control method

Abstract

The invention discloses a full-automatic inductor tin dipping device and a control method. The full-automatic inductor tin dipping device comprises an operating platform, an attracting device, a discharging device, an overturning device, a moving device, a soldering flux device, a tin dipping device body and a tin scraping device, wherein the attracting device is arranged on the discharging device, the discharging device is arranged on the left side of the operating platform, one end of the overturning device is connected with the attracting device, the other end of the overturning device is arranged on the moving device, the moving device is arranged on the operating platform, the soldering flux device is located on the right side of the discharging device, the tin dipping device is located on the right side of the soldering flux device, the moving device can move to the tin dipping device from a feeding position, and the tin scraping device is arranged on the right side of the tin dipping device body. By arranging the rod overturning device, a previous batch of workpieces can be naturally cooled while a current batch of workpieces are moved and dipped with tin, so that it is guaranteed that the workpieces will not be too hot when entering the discharging device, and the quality of the workpieces is guaranteed.

Description

technical field [0001] The invention relates to the research field of inductance preparation, in particular to a fully automatic inductance tin immersion device and a control method. Background technique [0002] With the development of electronic technology, more and more electronic devices appear around us, which brings a lot of convenience to our life. The large number of applications of electronic equipment has led to a huge demand for electronic components. Chip inductors are one of the electronic components that are in great demand. The main body of the chip inductor is an insulating tube and a wire. The wire is wound on the insulating tube one by one, and then the inductor is adsorbed on a magnetic carrier and immersed in a tin furnace. [0003] At present, in most domestic enterprises, manual operation is mostly used for soldering and tin immersion of components such as inductors. In this way, not only the speed of soldering and tin immersion is slow and the effici...

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Problems solved by technology

[0003] At present, in most domestic enterprises, manual operation is mostly used for soldering and tin immersion of components such as inductors. In this way, not only the speed of soldering and tin immersion is slow and the efficiency is low, but also the wires are often burned or soldered. , resulting in a low pass rate of chip inductors, which increases the production cost of the enterprise and reduces the production efficiency of the enterprise

In addition, in the process of soldering, the temperature of the tin furnace is high, and the production personnel are easily burned, and the tin is exposed to high temperature for a long time, and it will emit toxic fumes, which is not good for the health of the production operators.

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