Ultrathin PI cover film and preparation method thereof

A cover film, ultra-thin technology, applied in the field of ultra-thin PI cover film and its preparation, to achieve the effects of increasing flatness, improving alignment efficiency, improving product qualification rate and production efficiency

Active Publication Date: 2015-04-01
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the above technical problems, the present invention provides an ultra-thin PI cover film and its preparation method, which solves the problem of operability when the thickness of the PI film is lower than 12 μm, or even reduced to 7 μm or 5 μm

Method used

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  • Ultrathin PI cover film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] A kind of preparation method of ultra-thin PI covering film, comprises the steps:

[0030] (1) Preparation of low-viscosity PET carrier film:

[0031] Prepare low-viscosity agent, described low-viscosity agent comprises the following components by weight: 30 parts by weight of carboxyl-terminated nitrile rubber; 100 parts of bisphenol A epoxy resin 1001, wherein solid content 60%; dicyandiamide 18 parts of amine, dissolved in DMF solution, wherein the concentration of DICY dicyandiamide is 10%; 0.05 part of 2-ethylmethylimidazole; 120 parts of butanone. Dissolve the carboxy-terminated nitrile rubber in methyl ethyl ketone, add bisphenol A epoxy resin 1001, dicyandiamide 1, and 2 ethylmethylimidazole and mix well to obtain a low-viscosity adhesive;

[0032] Take a 25μm PET film for corona treatment, and then apply the low-viscosity agent on the corona-treated PET film. Curing for 1-2 hours, the obtained low-viscosity PET carrier film, the low-viscosity PET carrier film...

Embodiment 2

[0037] A kind of preparation method of ultra-thin PI covering film, comprises the steps:

[0038] (1) Preparation of low-viscosity PET carrier film: purchase PR-SS50N-01-1CM101 PET film coated with low-viscosity from Dewanli Technology, the release force is 5 g / 25mm, remove the protective film, and obtain low-viscosity PET carrier film;

[0039] (2) Preparation of carrier PI composite film: compound the above-mentioned low-viscosity PET carrier film and 5 μm ultra-thin PI film with a mulching machine, and the composite temperature is 80-120 ° C to obtain a carrier PI composite film;

[0040] (3) Composite of carrier PI composite film and release paper: Coating modified epoxy resin glue solution on the surface of carrier PI composite film, the drying thickness of the coating is controlled at 15 μm, drying, and then compounding with release paper to obtain super Thin PI cover film.

[0041] The above ultra-thin PI cover film was cured at 50°C for 13 hours, and the amount of gl...

Embodiment 3

[0043] A kind of preparation method of ultra-thin PI covering film, comprises the steps:

[0044] (1) Preparation of low-viscosity PET carrier film:

[0045]Prepare low-viscosity agent, described low-viscosity agent comprises the following components by weight: 30 parts by weight of carboxyl-terminated nitrile rubber; 100 parts of bisphenol A epoxy resin 1001, wherein solid content 60%; dicyandiamide 18 parts of amine, dissolved in DMF solution, wherein the concentration of DICY dicyandiamide is 10%; 0.05 part of 2-ethylmethylimidazole; 120 parts of butanone. Dissolve the carboxy-terminated nitrile rubber in methyl ethyl ketone, add bisphenol A epoxy resin 1001, dicyandiamide 1, and 2 ethylmethylimidazole and mix well to obtain a low-viscosity adhesive;

[0046] Take the 18μm PET film for corona treatment, and then apply the low-viscosity agent on the corona-treated PET film, control the thickness of the low-viscosity agent after drying to 5μm, dry at 150°C for 5min, and then...

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Abstract

The invention provides an ultrathin PI cover film and a preparation method thereof. The ultrathin PI cover film comprises a PI film, release paper arranged at one side of the PI film and an adhesive layer arranged between the PI film and the release paper, wherein the thickness of the PI film is 3-10mu m; the other side of the PI film is also provided with a low-adhesive PET carrier film comprising a PET film with the thickness of 10-50mu m and a low adhesive for adhering the PI film and the PET film; and the release force between the low adhesive and the PET film is larger than that between the low adhesive and the PI film. By using the ultrathin PI cover film and the preparation method thereof, the straightness of the PI film is improved through arranging the low-adhesive PET carrier film under the condition of unchanged substrate thickness when the thickness of the PI film is reduced to be smaller than 12mu m, the ultrathin PI cover film cannot deform after being coated by an adhesive, the operation is easy, the aligning efficiency of the cover film and a circuit board is increased, the automatic alignment is conveniently realized, and the qualified rate of products and the production efficiency in the wet-process production process of a substrate are increased.

Description

technical field [0001] The invention relates to the technical field of cover films, in particular to an ultra-thin PI cover film and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of smart phones, users are pursuing thinner and lighter mobile electronic products with larger display surfaces and more functions. This prompts manufacturers to require higher functional integration of products, thinner, thinner and more layers of circuit board materials, so as to achieve the design requirements of the final product. However, the thinner and thinner materials increase the difficulty of production, especially the thinning of the base material of flexible circuit boards makes the base material more likely to break, the yield rate of the production process decreases, and the production efficiency decreases. Therefore, it is inconvenient to maintain the thickness of the base material and reduce the thickness of the cover film. ...

Claims

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Application Information

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IPC IPC(8): B32B27/10B32B27/16B32B7/12B32B38/18B32B37/12
CPCB32B7/12B32B27/08B32B27/34B32B27/36B32B37/12B32B38/10B32B38/18B32B2307/734B32B2457/08
Inventor 伍宏奎
Owner GUANGDONG SHENGYI SCI TECH
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