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Defect detection method and device of semiconductor device

Active Publication Date: 2015-03-18
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] However, existing defect detection methods are time-consuming, labor-intensive and have low accuracy

Method used

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  • Defect detection method and device of semiconductor device
  • Defect detection method and device of semiconductor device
  • Defect detection method and device of semiconductor device

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Embodiment Construction

[0023] As mentioned in the background, the existing defect detection methods are time-consuming, heavy workload and low accuracy.

[0024] For details, please refer to figure 1 , is a flow diagram of a defect detection method, including:

[0025] Step S11, providing a wafer to be inspected;

[0026] Step S12, inspecting the inspected wafer, and marking defect positions on the inspected wafer;

[0027] Step S13, according to the marked defect position, obtain all defect position data on the wafer to be inspected;

[0028] After step S13, execute step S14 or S15, wherein:

[0029] Step S14, according to the defect location data, make the viewing device (such as a microscope) find the location of the defect on the wafer to be inspected, and use the inspection device to view the actual situation of the defect, such as the location of the semiconductor structure at the defect , the difference between structure, size and design standards;

[0030] Step S15, input the defect pos...

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Abstract

The invention discloses a defect detection method and device of a semiconductor device. The defect detection method of the semiconductor device comprises the following steps: providing a to-be-detected wafer; acquiring defect positions on the to-be-detected wafer; generating a plurality of interested regions according to the defect positions, wherein at least one defect exists in each interested region; acquiring defect position data in the interested regions; detecting the defects of the interested regions according to the defect position data in the interested regions; acquiring defect parameters in the interested regions. The defect detection method of the semiconductor device has the advantages of high efficiency, high accuracy and accurate and stable detection result.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a defect detection method and device for a semiconductor device. Background technique [0002] Semiconductor integrated circuit chips are manufactured through batch processing, and a large number of various types of semiconductor devices will be formed on the same substrate and connected to each other to have complete electronic functions. Wherein, defects generated in any step may lead to failure of circuit fabrication. Therefore, in the manufacturing process, it is often necessary to perform defect detection and analysis on the manufacturing structure of each step of the process to find out the cause of the defect and eliminate it. However, with the rapid development of Ultra Large Scale Integration (ULSI, Ultra Large Scale Integration), the integration of chips is getting higher and higher, and the size of devices is getting smaller and smaller. The defec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/67
CPCH01L22/12
Inventor 张静
Owner SEMICON MFG INT (SHANGHAI) CORP
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