Method for improving excessive circuit etching of circuit board

Abstract

The invention discloses a method for improving excessive circuit etching of a circuit board, belonging to the field of outer circuit etching of printed circuit boards. The method for improving excessive circuit etching of the circuit board disclosed by the invention comprises the following steps of: micro-electroplating a copper layer with the thickness of 5-6 mu m on a complete board; transferring an outer pattern onto the outer layer of the circuit board to form a circuit pattern, wherein the width of a copper circuit is 0.03-0.04 mm more than that of a copper circuit required practically; thickening a pattern electroplated copper layer till the thickness is 11-13 mu m, and then, electrotinning with the thickness of 5-6 mu m; and vacuumizing and etching after demoulding. According to the invention, the processes before and after etching are improved in an unified manner; therefore, the improvement range of outer circuit etching is enlarged; the effect of preventing excessive circuit etching can be achieved better; the production efficiency of outer circuit etching is effectively increased; scraps due to the fact that circuits are too thin are reduced; and the electroplating quality is increased.

Description

technical field [0001] The invention belongs to the field of circuit etching on the outer layer of printed circuit boards, and in particular relates to a method for improving circuit board circuit over-etching. Background technique [0002] For the refinement and high-density development of circuit boards, the requirements for the fineness of the outer layer lines are getting higher and higher, and the circuit etching method has also become a key link that must be improved in the circuit board industry. During the etching process of fine outer layer lines, excessive etching of fine lines often causes "line thinning", which leads to unstable electrical signal transmission of products, or product scrapping and other problems. [0003] The existing circuit board circuit production process: pre-process → whole board electroplating → outer layer pattern transfer → pattern electroplating → etching → post-process. Whole board electroplating requires copper plating thickness of 8μm...

AI Technical Summary

Problems solved by technology

At the same time, when etching, directly put the circuit board to be etched into the etching machine, and spray the etching potion to achieve the purpose of removing excess copper. During the etching process, the spray pressure will change, or there will be " Pool effect" and other problems, resulting in excessive etching, resulting in "fine lines"