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Packaging triode

A technology of triode and electrode, applied in the direction of transistor, electrical component, electric solid device, etc., can solve the problem of inconvenient disassembly of triode

Active Publication Date: 2015-03-04
东莞市柏尔电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem solved by the present invention: the packaged triode in the prior art, because the electrode of the triode is connected with the pin through the conductive glue, so, it is very inconvenient to disassemble the triode

Method used

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Examples

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Embodiment Construction

[0024] Such as figure 1 As shown, a packaged triode includes a base 10 , a triode, three pins 30 , a heat sink 40 and a cover 50 .

[0025] Such as figure 2 As shown, the base 10 is provided with a triode groove 101 , three pin grooves 102 , a connecting groove 103 between the pin groove 102 and the triode groove 101 , and a cooling fin groove 104 . Wherein, the triode groove 101 communicates with the heat sink groove 104 ; the pin groove 102 is provided with a protruding portion 1020 ; the heat sink groove 104 is provided with a concave portion 1040 . The edge of the base 10 is provided with buckles 11 .

[0026] Such as Figure 5 As shown, the heat sink 40 is first installed in the heat sink groove 104 , the heat sink 40 extends into the triode groove 101 , and the heat sink 40 protrudes from the edge of the base 10 . Afterwards, the triode is installed in the triode groove 101 , the triode is located above the heat sink 40 , and the bottom surface of the triode is in c...

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Abstract

Disclosed in the invention is a packaging triode comprising a pedestal, a triode body, three pins, a cooling fin, and a sealing cap. A triode groove, three pin grooves, a communicating groove of the pin grooves and the triode groove, and a cooling fin groove are formed in the pedestal. Buckles are arranged at the edges of the pedestal. The sealing cap is clamped at the pedestal; and a triode clamping block, three pin clamping blocks and cooling fin clamping block are arranged at the bottom surface of the sealing cap. According to the technical scheme, the triode body is clamped in the triode groove by the triode clamping block at the sealing cap bottom surface; the pins are clamped in the pin grooves by the three pin clamping blocks; and the cooling fin is clamped in the cooling fin groove by the cooling fin clamping block. The clamping is realized in a tight clamping mode, so that positioning stability of the triode, the three pins, and the cooling fin are guaranteed. Therefore, when the packaging triode needs to be dismounted, the triode body, the three pins, and the cooling fin can be taken out only by removing the sealing cap from the pedestal, so that dismounting of the packaging diode becomes convenient.

Description

technical field [0001] The invention relates to the technical field of triode manufacturing, in particular to a packaged triode. Background technique [0002] Currently, packaged transistors connected to electronic circuit boards function as switches and amplifiers. The entire area of ​​the SMD base island corresponding to the three pins of the existing packaged triode is provided with a silver-plated area, and the triode is mounted on the SMD base island with the silver-plated area through conductive glue; and this structure exists Certain disadvantages, because the entire area of ​​the SMD base island is equipped with a silver-plated area, resulting in high production costs for the pins, and the triode is easily delaminated when mounted on the SMD base island with a silver-plated area, and the reliability is low . [0003] In order to solve the above technical problems, the invention with the authorized announcement number CN201838584U and the authorized announcement dat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L29/73
Inventor 崔华生
Owner 东莞市柏尔电子科技有限公司
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