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Flexible underlying substrate and manufacturing method thereof

A technology of flexible substrates and manufacturing methods, applied in chemical instruments and methods, other household appliances, semiconductor/solid-state device manufacturing, etc., can solve problems such as damage to display devices, avoid defective products, control the bending direction, and avoid damage effect

Active Publication Date: 2015-03-04
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a flexible substrate and its manufacturing method, which solves the problem of unnecessary curling when the flexible substrate is peeled off from the carrier substrate in the manufacturing process of the existing display device, and avoids damage. The performance of the display device improves the display quality of the display device and prevents the final product from becoming a defective product

Method used

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  • Flexible underlying substrate and manufacturing method thereof
  • Flexible underlying substrate and manufacturing method thereof
  • Flexible underlying substrate and manufacturing method thereof

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Embodiment Construction

[0056] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0057] Embodiments of the present invention provide a flexible base substrate, the flexible base substrate is formed of flexible materials, refer to figure 1 As shown, the flexible substrate substrate includes: a first flexible film layer 1, wherein:

[0058] A plurality of grooves 2 are arranged on the lower surface of the first flexible film layer 1 .

[0059] Wherein, the grooves have the same thickness.

[0060]Specifically, in this embodiment, the mater...

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Abstract

The embodiment of the invention provides a flexible underlying substrate and a manufacturing method thereof, relates to the technical field of display and solves a problem of unnecessary warping in the process of stripping the flexible underlying substrate from a bearing substrate in the manufacturing process of an existing display device so that damage to performance of the display device is avoided, display quality of the display device is enhanced and the fact that the final products become defective products is avoided. The flexible underlying substrate is formed by flexible material. The underlying substrate comprises a first flexible film layer. The lower surface of the first flexible film layer is provided with multiple grooves which are identical in thickness. The invention is applied to the manufacturing technology of the flexible underlying substrate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a flexible substrate and a manufacturing method thereof. Background technique [0002] Flexible display is an important development direction of next-generation display technology. This technology has the characteristics of being bendable, not fragile, ultra-light and ultra-thin, low power consumption, and portable. Broad application prospects and good development prospects. At present, the manufacturing method of flexible display devices is usually to attach the flexible substrate on the rigid carrier substrate through adhesive, sacrificial layer, coating, etc., and then prepare the display device on it, and then mechanically or laser irradiate the flexible substrate. separate from the carrier substrate. [0003] Restricted by the existing technology, in current flexible displays, the wiring structures of flexible substrates (mainly including gate signal lines, common electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L27/12
CPCH01L21/02H01L27/12B32B2367/00B32B2457/20H01L21/6835H01L27/1218H01L27/1262H01L29/78603H01L2221/6835B32B27/06B32B27/281B32B27/365B32B37/14H01L23/13H01L23/18H01L2221/68386
Inventor 高涛毛雪周伟峰
Owner BOE TECH GRP CO LTD
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