Fixing plugboard for printed circuit board

Abstract

The invention discloses a fixing plugboard for a printed circuit board. The fixing plugboard comprises a plugboard body, the plugboard body is provided with a slot, and the width of the slot is adaptive to the thickness of the printed circuit board. According to the fixing plugboard for the printed circuit board, provided by the invention, the plugboard body is provided with the slot for clamping the printed circuit board, when the printed circuit board passes through a peak furnace, the fixing plugboard is pressed to at least one side of the printed circuit board, the slot of the fixing plugbaord and the edge of the printed circuit board cooperate in a clamping mode so as to be fixed together, thus deformation is reduced. Before furnace operation, the fixing plugboard is pressed to the at least one side of the printed circuit board, the printed circuit board can be fixed, deformation due to heating of the printed circuit board is prevented, the risk of falling off from the conveying track of the peak furnace is avoided, and the risk of fusion soldering tin rushing to the top surface of the printed circuit board is also avoided, such that the problem that a lot of printed circuit boards are took out from a production line is prevented, and the quality of the printed circuit board and the production efficiency are improved.

Description

technical field [0001] The invention relates to the technical field of wave soldering of circuit boards, and more specifically relates to a fixed plug-in board for printed circuit boards. Background technique [0002] Wave soldering is a soft soldering method, which drives the molten solder upward through a mechanical pump or electromagnetic pump, and the jet flow forms a solder wave peak that meets the design requirements, and makes the printed circuit board pre-installed with electronic components to be soldered The surface passes through the solder wave crest, so that the electrical connection between the solder terminal or pin of the electronic component exposed on the surface of the printed circuit board to be soldered and the pad of the printed circuit board is realized. [0003] The process of soldering printed circuit boards by wave soldering process is: the printed circuit board contacts the tin flow peak formed in the wave furnace with the surface of the printed ci...

AI Technical Summary

Problems solved by technology

[0004] At present, when some printed circuit boards pass through the wave furnace, due to reasons such as large and thin printed circuit boards or many hollows, the printed circuit boards are heated and deformed in the preheating section of the wave furnace, and the middle is sunken. If it is not serious, it will also face the danger of molten solder rushing to the top surface of the printed circuit board when passing the peak of the tin flow, which will cause a large number of printed circuit boards to go offline, seriously affecting the quality and production efficiency

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